Physical Properties | Metric | English | Comments |
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Spiral Flow | 63.0 - 87.0 cm | 24.8 - 34.3 in | 177°C/1000 psi |
Cookson Group Plaskon® 440 Mineral Filled Novolac Epoxy Molding Compound
(discontinued **) Test specimens were transfer molded and post cured 4 hours at 175°C.Combines exceptional reliability with wide molding process latitude. This material is designed to encapsulate semiconductor devi.. |
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Spiral Flow | 63.0 - 87.0 cm | 24.8 - 34.3 in | 177°C/1000 psi |
Cookson Group Plaskon® 1002 Conventional Encapsulant
(discontinued **) Test specimens were transfer molded and post cured 4 hours at 175°C.A low cost, low stress, conventional molding compound recommended for high volume commodity-type packages that house simple linea.. |
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Spiral Flow | 63.0 - 87.0 cm | 24.8 - 34.3 in | 177°C/1000 psi |
Cookson Group Plaskon® 3400 Epoxy Molding Compound
(discontinued **) Test specimens were transfer molded and post cured 4 hours at 175°C.A reduced-stress epoxy molding compound for the encapsulation of a variety of semiconductor devices ranging from small lead count.. |