Physical Properties | Metric | English | Comments |
---|---|---|---|
Spiral Flow | 140 cm | 55.1 in | 175°C/1000 psi |
Cookson Group Plaskon® SMT-B-1 LAS (146.408) Epoxy Molding Compound for PBGAs
(discontinued **) Test specimens were transfer molded and post cured 4 hours at 175°C.An epoxy molding compound optimized specifically for grid arrays (BGA/LGA) requiring low alpha particle count. It is formulated .. |