Physical Properties | Metric | English | Comments |
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Density | 3.00 g/cc | 0.108 lb/in³ | |
Nabaltec APYRAL® AOH 30 AlO(OH) Boehmite Mineral flame retardant for wire and cable industry, electronic industry and public transport.Properties:High temperature applicationsLow sedimentation at good viscosity performance in resinsGood ch.. |
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Density | 3.00 g/cc | 0.108 lb/in³ | |
Nabaltec APYRAL® AOH 60 AlO(OH) Boehmite Mineral flame retardant for wire and cable industry, electronic industry and public transport.Properties:High temperature applicationsLow sedimentation at good viscosity performance in resinsGood ch.. |
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Density | 3.00 g/cc | 0.108 lb/in³ | |
Rogers Corporation RO3210 Woven-Glass Reinforced PTFE Laminate Features and Benefits:Woven glass reinforcement - Improves rigidity for easier handlingUniform electrical and mechanical performance - ideal for complex multi-layer high frequency structuresLow diel.. |
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Density | 3.00 g/cc | 0.108 lb/in³ | |
Nabaltec APYRAL® AOH 20 AlO(OH) Boehmite Mineral flame retardant for wire and cable industry, electronic industry and public transport.Properties:High temperature applicationsLow sedimentation at good viscosity performance in resinsGood ch.. |
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Density | 3.00 g/cc | 0.108 lb/in³ | after firing to 110°C |
Pyrotek Pyrocast 92AC Tabular Alumina Based Low Cement Castable Pyrocast 92AC is a tabular alumina based low cement castable, enhanced with non-wetting matrix. The silica-free matrix eliminates the potential for aluminum attack on silica with in the bonding mat.. |
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Density | 3.00 g/cc | 0.108 lb/in³ | Apparent |
Gouda Vuurvast AK 85 K Dense Refractory Brick Description: Corundum based bricks with a mullite bond. Application: rotating incinerator furnacesRemarks: This data represents average values, obtained from samples that were cut from standard bric.. |
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Density | 3.00 g/cc | 0.108 lb/in³ | |
LATI Laticonther 83 CP/85 PA12, Impact Modified High thermal conductivity product based on Polyamide 12 (PA12), impact modified. Special filler.Availability: Africa & Middle East; Asia Pacific; Europe; Latin America; North AmericaInformation prov.. |
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Density | 3.00 g/cc | 0.108 lb/in³ | |
Schott 8235 Dental Glass Remarks: Ba-containing, without FApplication: CompositeAdvantagesGreater variety of composition and refractive indiciesOutstanding transparencyBest radiopacitiesInformation Provided by SCHOTT North .. |
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Density | 3.00 g/cc | 0.108 lb/in³ | |
Schott G018-186 Dental Glass Remarks: Ba- and F-containing, high refractive glassApplication: CompositeAdvantagesGreater variety of composition and refractive indiciesOutstanding transparencyBest radiopacitiesInformation Provid.. |
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Density | 3.00 g/cc | 0.108 lb/in³ | |
Schott G018-310 Dental Glass Remarks: Zr-containing, high refractive indexApplication: CompositeAdvantagesGreater variety of composition and refractive indiciesOutstanding transparencyBest radiopacitiesInformation Provided by S.. |
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Density | 3.00 g/cc | 0.108 lb/in³ | ASTM D792 |
Techmer ES HiFill® ABS HI 0300 High Impact Availability: North AmericaForms: PelletsFiller/Reinforcement: Unspecified Filler/ReinforFeatures: High Density and High Impact ResistanceProcessing Method: Injection MoldingInformation provided by .. |
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Density | 2.99 g/cc | 0.108 lb/in³ | ASTM D792 |
Techmer ES HiFill® PA6 0301 Availability: North AmericaForms: PelletsFiller/Reinforcement: Unspecified Filler/ReinforFeatures: High DensityProcessing Method: Injection MoldingInformation provided by TP Composites, Inc. |
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Density | 3.00 g/cc | 0.108 lb/in³ | |
Specialty Materials SCS-6 Silicon Carbide Monofilament High strength at high temperature. These fibers are used in metal, ceramic and polymer matrix composites and are extremely effective for high-temperature applications. Silicon carbide reinforced tit.. |
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Density | 3.00 g/cc | 0.108 lb/in³ | |
Schott N-KZFS4 Glass Information Provided by SCHOTT North America, Inc. |
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Density | 3.00 g/cc | 0.108 lb/in³ | ASTM C135 |
M Cubed Technologies SSC-702 Reaction-Bonded Silicon Carbide Medium-grained reaction-bonded SiC for high wear applications. Bullnoses, fan liners, hydrocyclone liners, etc. Can be cast into very large shapes (greater than 4 ft. square, 5-6 inches thick)Info.. |
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Density | 3.00 g/cc | 0.108 lb/in³ | ASTM C135 |
M Cubed Technologies SSC-802 Reaction-Bonded Silicon Carbide Medium-grained reaction-bonded SiC for high wear applications. Bullnoses, fan liners, hydrocyclone liners, etc. Can be cast into very large shapes (greater than 4 ft. square, 5-6 inches thick)Info.. |
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Density | 3.00 g/cc | 0.108 lb/in³ | ASTM C135 |
M Cubed Technologies SSC-FG Reaction-Bonded Silicon Carbide, Fine-Grained Fine-grained reaction-bonded SiC. Used for mechanical seals and other SiC applications that require a high surface finish/tight tolerances. Si content can be tailored for the application.Informati.. |
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Density | 3.00 g/cc | 0.108 lb/in³ | ISO 1183 |
Polyram Metal Cap PL380Z81 Heavy Density Polyethylene, 81% Mineral Filled 81% Mineral filled, heavy density polyethylene for injection molding metalized part and galvanized covers.Information provided by Polyram. |
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Density | 3.00 g/cc | 0.108 lb/in³ | |
Trelleborg Emerson & Cuming Eccobond® 83C Two-Component Silver Filled Electrically Conductive Epoxy Adhesive Emerson & Cuming 83C Eccobond® Two-Component Silver Filled Electrically Conductive Epoxy AdhesiveTwo component, silver filled, electrically conductive, epoxy adhesive. Smooth, creamy consistency. G.. |
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Density | 3.00 g/cc | 0.108 lb/in³ | |
Epoxyset Epoxiohm EO-21 Electrically Conductive Epoxy Adhesive EO-21 is a two part, silver filled high electrical conductivity epoxy adhesive. It is designed to cure at room temperature or rapidly at elevated temperature and exhibits very excellent adhesion and.. |
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Density | 3.00 g/cc | 0.108 lb/in³ | |
Epoxyset Epoxiohm EO-21M-5 Electrically Conductive Epoxy Adhesive EO-21M-5 is an electrically conductive & thermally conductive, silver filled epoxy adhesive. This two component system is designed to be cured at room temperature or the cure can be accelerated by e.. |
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Density | 3.00 g/cc | 0.108 lb/in³ | |
Epoxyset Epoxiohm EO-23M Electrically Conductive Epoxy Adhesive EO-23M is an electrically conductive, low viscosity silver-filled epoxy adhesive. Used for hybrid / micro-electronic adhesive including die-attach and substrate attach for Rf and Microwave devices.I.. |
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Density | 2.99 g/cc | 0.108 lb/in³ | ISO 1183 |
Eurostar Staramide 6 80E7 PA6, Injection Molded Staramide 6 80E7 is a high density, Polyamide 6, Injection Molding Resin (also known as 680E7)Information provided by Eurostar. |
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Density | 2.99 g/cc | 0.108 lb/in³ | |
Ceradyne Ceralloy® 137 CA AlN Composite Applications: cryogenic environment applicationsterminationssever wedgesload pelletsabsorbersFeatures: dielectric loss independent from temperature.Information provided by Ceradyne Company |
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Density | 2.99 g/cc | 0.108 lb/in³ | |
Ceradyne Ceralloy® 137 CB AlN Composite Applications: replacement for Ceralloy® 2710 BeO-SiCterminationssever wedgesload pelletsabsorbersFeatures: higher thermal conductivity then Ceraloy® BeO-SiC at temperatures greater then 150°C, cl.. |
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Density | 2.99 g/cc | 0.108 lb/in³ | |
Ceramic Process Systems AlSiC-8, 70 vol% SiC Aluminum alloy A356.2 used. Hermeticity < 1x109 atm-cc/s He.CPS fabricates AlSiC by preparing an SiC preform which is subsequently infiltrated by molten aluminum metal. After infiltration, compone.. |
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Density | 3.00 g/cc | 0.108 lb/in³ | ASTM D1475 |
Aptek 2313-PMF Hybrid Epoxy Adhesive Snap-cure, silver-filled; long pot-life/stable viscosity-excellent for robotics. Thermal shock resistant.Production-oriented, snap-cure technology for surface mount applications-allows cure during s.. |
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Density | 3.00 g/cc | 0.108 lb/in³ | ASTM D1475 |
Aptek 6512-PMF Electronic grade, conductive epoxy adhesive APTEK 6512-PMF is a one component, 100% solid, silver-filled, electrically conductive epoxy adhesive specifically designed for the attachment of electronic components to printed circuit boards. APT.. |