Physical Properties | Metric | English | Comments |
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Density | 1.85 g/cc | 0.0668 lb/in³ | ASTM D792 |
Multibase Multi-Flex® TPE G 7155 BLK Multi-Flex® G 7155 is based on Shell's Kraton G technology, manufactured under the license of Shell. Multibase certifies that his product has been formulated with the same ingredients as manufactu.. |
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Density | 1.85 g/cc | 0.0668 lb/in³ | Green Density |
Nabaltec NABALOX® NO 113 Ground Alumina NABALOX® aluminum oxide has a number of advantages including low sintering temperaturewide sintering rangeflexible processinghigh sintered densities high wear and impact resistanceelectrical insula.. |
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Density | 1.85 g/cc | 0.0668 lb/in³ | ASTM D792 |
Owens Corning Glass Fiber Reinforced Polyester SMC (Compression), 30 wt.% glass Polyester thermosets are available in many formulations. They can be formulated for good to excellent resistance to acids, weak alkalis, and organic solvents. However, they are not recommended for u.. |
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Density | 1.85 g/cc | 0.0668 lb/in³ | |
Premix Thermoplastics PRESEAL® TPE 6070 PRESEAL TPE 6070 is a thermoplastic elastomer based highly conductive compound intended primarily for EMI gasketing and grounding applications. Conductivity is achieved with a silver coated glass sp.. |
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Density | 1.85 g/cc | 0.0668 lb/in³ | |
3M Dyneon™ Fluorel™ FLS-2530 Fluoroelastomer VF2 + HFP Dipolymer
(discontinued **) Data provided by the manufacturer, Dyneon LLC.Incorporated cure polymer, 69%F in polymer with 22% Medium Thermal Carbon Black (N990), 2% MgO, and 4% Ca(OH)2. High fluorine dipolymer with improved f.. |
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Density | 1.85 g/cc | 0.0668 lb/in³ | |
Cookson Group Plaskon® LS-16S Molding Compound
(discontinued **) Test specimens were transfer molded and post cured 4 hours at 175°C.A low stress molding compound specifically formulated for use with conventional molding equipment to increase semiconductor manuf.. |
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Density | 1.85 g/cc | 0.0668 lb/in³ | ASTM D792 |
G-9 Fiberglass Melamine Laminate Sheet This material is very hard, flame resistant, and has excellent electrical properties. G-9 has high arc and heat resistance and is recommended for humid environments. It is used for switch board pane.. |
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Density | 1.85 g/cc | 0.0668 lb/in³ | ASTM D572 |
Haysite 14200 Polyester BMC, 15% Glass Reinforced The 14200 series bulk molding compound is one of Haysite's newest molding compound families. This grade can be compression, transfer, or injection molded. Good mechanical strength and exceptional a.. |
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Density | 1.85 g/cc | 0.0668 lb/in³ | ASTM D792 |
Glastic Laminates/Shapes SG-200 Fiberglass-Reinforced Polyester Rod Data provided by Glastic Corporation.A continuous-filament fiberglass-roving provides superior strength. Excellent thermal endurance - used to replace silicone rod. |
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Density | 1.85 g/cc | 0.0668 lb/in³ | ASTM D891 |
Solvay Specialty Polymers FOMBLIN® Z60 PFPE Lubricant FOMBLIN® Z is a linear PFPE available as a neutral or functionalized fluid. They are used in aerospace, magnetic media, and polymer modification uses.Information provided by Solvay Solexis, Inc... |
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Density | 1.85 g/cc | 0.0668 lb/in³ | ASTM D792 |
SABIC Innovative Plastics LNP THERMOCOMP UFW49S PPA LNP* THERMOCOMP* UFW49S is a compound based on Polyphthalamide resin containing 45% Glass Fiber, 20% Wollastonite. Added features of this material include: Heat Stabilized, Low Warpage. |
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Density | 1.85 g/cc | 0.0668 lb/in³ | Relative Density; ISO 1183 |
Vyncolit G865 Novolac Phenolic Glass fiber filled phenolic molding compound with high mechanical, good thermal and electrical properties. USES: Asbestos-free replacement for die-cast automotive metal parts, e.g. reactors for aut.. |
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Density | 1.85 g/cc @Thickness >=0.000 mm |
0.0668 lb/in³ @Thickness >=0.000 in |
24hr/23°C/50% RH; ISO 1183-A; IEC/EN 61212-2 7.3 |
Elektro-Isola G-Etronax B Phenolic, Glass Fabric Reinforcement, Dark Brown, Tubes Description: Mechanical and electrical applications. High mechanical strength. Self-extinguishing, halogen-free. Good resistance to chemicals.Information provided by Elektro-Isola |
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Density | 1.85 g/cc | 0.0668 lb/in³ | 24hr/23°C/50% RH; ISO 1183-A; IEC/EN 60893-2 8.1 |
Elektro-Isola G-Etronax PM 953 Polyester, Glass Mat, Off White, Sheets Description: Good electrical properties such as high breakdown voltage in air and oil and highest arc resistance and tracking resistance. Self-extinguishing. Low smoke emission, halogen-free. Very m.. |
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Density | 1.85 g/cc | 0.0668 lb/in³ | ISO 1183 |
EMS-Grivory Grivory® GVX-7 H nat PA*-GF70 Product description: Grivory GVX-7H natural is a 70% glass-fiber reinforced engineering thermoplastic material based on a combination of semi-crystalline polyamide with partially aromatic copolyamid.. |
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Density | 1.85 g/cc | 0.0668 lb/in³ | ISO 1183 |
Eurotec® Tecodur® PB70 GF45 NL PBT 45% filled, high gloss, increased density Excellent stiffness and hardnessGood mechanical strengthGood creep and fatigue behaviorVery good thermal stabilityExcellent flammability characteristicsGood electrical propertiesHigh wear resistance.. |
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Density | 1.85 - 2.10 g/cc | 0.0668 - 0.0759 lb/in³ | Molding; IS 867-1963 |
Amity Thermosets ATR 457© Phenolic Molding Glass fiber Filler, Compression Molded Characteristics:High shock resistant ( high impact strength ) High Mechanical StrengthHigh Dielectric StrengthHigh Electrical Insulation Color- pale brown Medium flow Applications:Electric motor en.. |
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Density | 1.85 g/cc | 0.0668 lb/in³ | ASTM D792 |
Applied Composites 8041 Polyester SMC Industry Application: ElectricalProduct Application: Business MachinesDistinct Features: UL 94-VO, Radiant Panel |
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Density | 1.85 - 2.05 g/cc | 0.0668 - 0.0741 lb/in³ | Molded |
Bulk Molding Compounds BMC T15(F) High Strength Grade Molding Compound BMC T15F is a high strength, low shrink general purpose molding compound. Due to the excellent flow and controlled reactivity, BMC T15F is well suited for injection, transfer or compression molding.. |
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Density | 1.85 g/cc | 0.0668 lb/in³ | ASTM D792 Method A |
Arlon 45N Multifunctional Epoxy Laminate and Prepreg Arlon 45N is a tough, high Tg (175°C by DSC) multifunctional epoxy laminate and prepreg system designed for use in a variety of higher layer count MLBs. Processable using conventional FR-4 conditi.. |
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Density | 1.85 g/cc | 0.0668 lb/in³ | ASTM D792 |
Solvay Specialty Polymers Ixef® 2530/X9027 Polyarylamide, 55% Mineral + Glass Fiber, DAM
(discontinued **)< The IXEF compounds are a family of semi-crystalline polyarylamide thermoplastics reinforced with glass fibers and/or mineral fillers for injection molding.Data provided by the manufacturer, Solvay A.. |
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Density | 1.85 g/cc | 0.0668 lb/in³ | Dry as molded |
Solvay Specialty Polymers Ixef® 2530/X9027 Polyarylamide, 55% Mineral + Glass Fiber, at Equilibrium (65% RH)
The IXEF compounds are a family of semi-crystalline polyarylamide thermoplastics reinforced with glass fibers and/or mineral fillers for injection molding.Data provided by the manufacturer, Solvay A.. |
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Density | 1.85 g/cc | 0.0668 lb/in³ | ISO 1183 |
Hexion Bakelite™ EP 8412 Epoxy Resin, High Arc Resistance, Improved Electrical Properties, Low Shrinkage Epoxy molding compound, inorganically filled, glass fiber reinforced, heat resistant, dimensionally stable, good electrical and mechanical properties, very good chemical resistance, low viscosity, U.. |
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Density | 1.85 g/cc | 0.0668 lb/in³ | ASTM D792 |
G-5 Fiberglass Melamine Laminate Sheet This material is very hard, flame resistant, and has excellent electrical properties. G-5 has high arc and heat resistance. It used for switch board panels, arc barriers, circuit breaker parts, and .. |
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Density | 1.85 g/cc | 0.0668 lb/in³ | ASTM D792 |
Quantum Composites QC-8770 63% Glass Fiber Hybrid Vinyl Ester SMC
(discontinued **) QC-8770 is a hybrid vinyl ester-based sheet molding compound (SMC) designed for compression molding of components requiring high structural strength. It exhibits unusual toughness, and excellent st.. |
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Density | 1.85 - 2.30 g/cc | 0.0668 - 0.0831 lb/in³ | Compounded |
Fluorocarbon Rubber (FPM), Low Temperature Grade Fluorocarbon rubbers are very stable toward degradation by chemicals, heat, and oxidation. Some chemicals that attack FPM include ketones, low molecular weight esters, and nitrogen containing solve.. |