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Tra-Con Tra-Bond 868-3N1 Room Temperature Cure Adhesive
| Category | Polymer , Adhesive , Thermoset |
| Manufacturer | Tra-Con, Inc. |
| Trade Name | Tra-Bond |
| Port | Shanghai port,China |
| Trade Terms | FOB, CFR, CIF |
| Payment Terms | L/C, T/T, Western Union |
| Download PDF | Tra-Con Tra-Bond 868-3N1 Room Temperature Cure Adhesive.pdf  |
| Price | EMAIL US sales@lookpolymers.com |
Material Notes:
TRA-BOND 868-3N1 room temperature cure adhesive provides strong bonds to difficult-to-bond metals, such as gold, silver, copper, brass, and solder.Information provided by Tra-Con Inc.
| Physical Properties | Metric | English | Comments |
|---|---|---|---|
| Viscosity | 76000 cP @Temperature 25.0 °C |
76000 cP @Temperature 77.0 °F |
After mixing |
| Mechanical Properties | Metric | English | Comments |
|---|---|---|---|
| Hardness, Shore D | 86 | 86 | |
| Adhesive Bond Strength | 37.9 MPa | 5500 psi | Lap shear, alum to alum, @ 25°C |
| Thermal Properties | Metric | English | Comments |
|---|---|---|---|
| CTE, linear | 110 µm/m-°C | 61.1 µin/in-°F | Below Tg |
| 280 µm/m-°C | 156 µin/in-°F | Above Tg | |
| Glass Transition Temp, Tg | 66.0 °C | 151 °F | Ultimate Tg |
| Electrical Properties | Metric | English | Comments |
|---|---|---|---|
| Volume Resistivity | 5.00e+14 ohm-cm @Temperature 100 °C |
5.00e+14 ohm-cm @Temperature 212 °F |
| Processing Properties | Metric | English | Comments |
|---|---|---|---|
| Cure Time | 30.0 min @Temperature 75.0 °C |
0.500 hour @Temperature 167 °F |
|
| 480 min @Temperature 25.0 °C |
8.00 hour @Temperature 77.0 °F |
||
| Shelf Life | 12.0 Month | 12.0 Month |
| Descriptive Properties | Value | Comments |
|---|---|---|
| Working Life minutes | 30 |
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