TRA-BOND 816K01 is a flexible, thixotropic, thermal conductive epoxy system. TRA-BOND 816K01 cures at room temperature and can be used for staking transistors, diodes, resistors, integrated circuits and other heat-sensitive components to printed circuit boards. This two-part adhesive develops strong, durable, high-impact bonds at room temperature, which improve heat transfer while maintaining electrical insulation. TRA-BOND 816K01 bonds readily to itself, and to metals, silica, steatite, alumina, sapphire and other ceramics, glass, plastics and many other materials, because its coefficient of thermal expansion provides a good match for those materials over a fairly wide temperature range. Fully cured TRA-BOND 816K01 provides excellent resistance to salt solutions, mild acids and alkalis, and many other chemicals including petroleum solvents, lubricating oils, and alcohol.Information provided by Tra-Con Inc.