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Tra-Con Tra-Bond 816H04 High Temperature Thermally Conductive Compound

Category Polymer , Adhesive , Thermoset , Epoxy
Manufacturer Tra-Con, Inc.
Trade Name Tra-Bond
Port Ningbo port,China
Trade Terms FOB, CFR, CIF
Payment Terms L/C, T/T, Western Union
Download PDF Tra-Con Tra-Bond 816H04 High Temperature Thermally Conductive Compound.pdf
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Material Notes:
Tra-Bond 816H04 is specifically designed for high temperature applications that require good thermal conductivity. This two-part thixotropic epoxy system is recommended for chip bonding and staking electrical components. Tra-Bond 816H04 bonds readily to metals, ceramics, glass, and plastics.Information provided by Tra-Con Inc.
Physical Properties Metric English Comments
Specific Gravity 1.50 g/cc
1.50 g/cc
Mixed
Viscosity 49000 cP
49000 cP
Mixed (cp #52, 5 rpm)
Mechanical Properties Metric English Comments
Hardness, Shore D 80
80
Adhesive Bond Strength 10.3 MPa
1500 psi
Lap shear, alum to alum, 1 hr @ 65°C
Thermal Properties Metric English Comments
CTE, linear 49.0 µm/m-°C
27.2 µin/in-°F
Below Tg
195 µm/m-°C
108 µin/in-°F
Above Tg
Glass Transition Temp, Tg 85.0 °C
185 °F
Ultimate Tg
Processing Properties Metric English Comments
Cure Time 60.0 min

@Temperature 65.0 °C
1.00 hour

@Temperature 149 °F
1440 min

@Temperature 25.0 °C
24.0 hour

@Temperature 77.0 °F
Descriptive Properties Value Comments
Color White
Mixed
Mix Ratio, parts by weight 100/99
Resin/Hardener
Thixotropic Index 3.7
cp #52, 1 rpm/10 rpm
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