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Tra-Con Tra-Bond 2112 Rigid Epoxy Staking Compound

Category Polymer , Adhesive , Thermoset , Epoxy , Filled/Reinforced Thermoset
Manufacturer Tra-Con, Inc.
Trade Name Tra-Bond
Port Ningbo port,China
Trade Terms FOB, CFR, CIF
Payment Terms L/C, T/T, Western Union
Download PDF Tra-Con Tra-Bond 2112 Rigid Epoxy Staking Compound.pdf
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Material Notes:
TRA-BOND 2112 is a thixotropic epoxy system recommended for critical electronic, aerospace and industrial bonding, laminating and reinforcing applications requiring an adhesive with high-fill, non-sag characteristics. This two-part, solvent-free adhesive is easily mixed and used for staking components to printed circuit boards for enhanced mechanical rigidity, and for bonding, laminating and repair applications involving metals, glass, ceramics, wood and many plastics. TRA-BOND 2112 hardens to a tough, enamel-like coating offering good chemical resistance as well as superior physical and mechanical properties. The cured adhesive provides good electrical insulation and resistance to weather, galvanic action, petroleum products and lubricants, alcohol, salts, mild acids and alkalis, and other organic and inorganic compounds.Information provided by Tra-Con Inc.
Physical Properties Metric English Comments
Specific Gravity 1.20 g/cc
1.20 g/cc
Mixed
Solids Content 100 %
100 %
Reactive Solids Content
Viscosity 60000 cP
60000 cP
Mixed (rv #7, 10 rpm)
Mechanical Properties Metric English Comments
Hardness, Shore D 90
90
Adhesive Bond Strength 13.1 MPa
1900 psi
Lap shear, alum to alum, 2 hrs @ 65°C
Izod Impact, Notched 0.400 J/cm
0.750 ft-lb/in
Thermal Properties Metric English Comments
CTE, linear 55.0 µm/m-°C

@Temperature 20.0 °C
30.6 µin/in-°F

@Temperature 68.0 °F
Maximum Service Temperature, Air 125 °C
257 °F
Minimum Service Temperature, Air -60.0 °C
-76.0 °F
Glass Transition Temp, Tg 93.0 °C
199 °F
Ultimate Tg
Electrical Properties Metric English Comments
Volume Resistivity 6.00e+13 ohm-cm
6.00e+13 ohm-cm
6.00e+13 ohm-cm

@Temperature 100 °C
6.00e+13 ohm-cm

@Temperature 212 °F
Dielectric Constant 4.6

@Frequency 1000 Hz
4.6

@Frequency 1000 Hz
Dielectric Strength 16.1 kV/mm
410 kV/in
Dissipation Factor 0.010

@Frequency 1000 Hz
0.010

@Frequency 1000 Hz
Processing Properties Metric English Comments
Cure Time 240 min

@Temperature 65.0 °C
4.00 hour

@Temperature 149 °F
1440 min

@Temperature 25.0 °C
24.0 hour

@Temperature 77.0 °F
Pot Life 30 min
30 min
Descriptive Properties Value Comments
Color Milky, Translucent
Mix Ratio, parts by weight 100/22
Resin/Hardener
Thixotropic Index 6.5
1 rpm/10 rpm
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