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Sumitomo Bakelite North America E 8354-19189-2 Electrical Encapsulation Grade Epoxy

Category Polymer , Thermoset , Epoxy , Epoxy, Encapsulating, Glass or Mineral Filled , Epoxy, High Temperature , Filled/Reinforced Thermoset
Manufacturer Sumitomo Bakelite North America
Trade Name
Port Ningbo port,China
Trade Terms FOB, CFR, CIF
Payment Terms L/C, T/T, Western Union
Download PDF Sumitomo Bakelite North America E 8354-19189-2 Electrical Encapsulation Grade Epoxy.pdf
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Material Notes:
Glass and mineral reinforced epoxy molding compound, formulated for the encapsulation of devices requiring high quality and thermal shock resistance.Information provided by Vyncolit, a Sumitomo Bak Group
Physical Properties Metric English Comments
Bulk Density 0.800 g/cc
0.0289 lb/in³
Powder Density; ASTM D1895
Density 1.84 g/cc
0.0665 lb/in³
Relative Density; ASTM D792
Linear Mold Shrinkage 0.0030 - 0.0035 cm/cm
0.0030 - 0.0035 in/in
Compression Molding; ASTM D955
Mechanical Properties Metric English Comments
Tensile Strength at Break 72.0 MPa
10400 psi
ASTM D638
Flexural Strength 124 MPa
18000 psi
At Rupture; ASTM D790
Flexural Modulus 16.5 GPa
2390 ksi
ASTM D790
Compressive Strength 210 MPa
30500 psi
ASTM D695
Izod Impact, Notched 0.240 J/cm
0.450 ft-lb/in
ASTM D256
Thermal Properties Metric English Comments
CTE, linear, Parallel to Flow 17.0 µm/m-°C

@Temperature 20.0 °C
9.44 µin/in-°F

@Temperature 68.0 °F
ASTM E-831
Deflection Temperature at 1.8 MPa (264 psi) >= 282 °C
>= 540 °F
Post Baked; ASTM D648A
Electrical Properties Metric English Comments
Dielectric Constant 4.8

@Frequency 1e+6 Hz
4.8

@Frequency 1e+6 Hz
Dry; ASTM D150
Dielectric Strength 14.7 kV/mm
373 kV/in
60Hz, Short Time, dry; ASTM D149
Dissipation Factor 0.014

@Frequency 1e+6 Hz
0.014

@Frequency 1e+6 Hz
Dry; ASTM D150
Arc Resistance 180 sec
180 sec
ASTM D495
Descriptive Properties Value Comments
Color Black
Form Granular
Main Filler Glass Fiber & Mineral
Molding Method Compression, transfer
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