Solvay Specialty Polymers Torlon® 4200 Polyamide-imide (PAI) (Unverified Data**)

Category	Polymer , Thermoplastic , Polyamide-imide (PAI) , Polyamide-Imide, Extruded
Manufacturer
Trade Name
Port	Shanghai port,China
Trade Terms	FOB, CFR, CIF
Payment Terms	L/C, T/T, Western Union
Download PDF	Solvay Specialty Polymers Torlon® 4200 Polyamide-imide (PAI) (Unverified Data**).pdf
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Material Notes:

Torlon 4200 is an unreinforced, unpigmented grade of polyamide-imide (PAI) resin for extrusion. This grade is designed for applications in the semiconductor industry which cannot tolerate particulates such as metals or inorganic particles migrating from the polymer. Torlon 4200 has the best impact resistance and greatest elongation of all the Torlon grades. Torlon PAI has the highest strength and stiffness of any thermoplastic up to 275°C (525°F). It has outstanding resistance to wear, creep, and chemicals. - High Flow: Torlon 420O EXTInformation provided by Solvay Specialty Polymers.

Physical Properties	Metric	English	Comments
Specific Gravity	1.42 g/cc	1.42 g/cc	ASTM D792
Water Absorption	0.33 % @Time 86400 sec	0.33 % @Time 24.0 hour	ASTM D570
Linear Mold Shrinkage, Flow	0.0060 - 0.0085 cm/cm	0.0060 - 0.0085 in/in	ASTM D955

Mechanical Properties	Metric	English	Comments
Tensile Strength	152 MPa	22000 psi	Type I; ASTM D638
Tensile Stress	192 MPa	27800 psi	ASTM D1708
Elongation at Break	7.6 %	7.6 %	Type I; ASTM D638
	15 %	15 %	ASTM D1708
Tensile Modulus	4.48 GPa	650 ksi	Type I; ASTM D638
	4.90 GPa	711 ksi	ASTM D1708
Flexural Strength	118 MPa @Temperature 232 °C	17100 psi @Temperature 450 °F	ASTM D790
	241 MPa @Temperature 23.0 °C	35000 psi @Temperature 73.4 °F	ASTM D790
Flexural Modulus	3.59 GPa @Temperature 232 °C	521 ksi @Temperature 450 °F	ASTM D790
	5.03 GPa @Temperature 23.0 °C	730 ksi @Temperature 73.4 °F	ASTM D790
Compressive Strength	221 MPa	32100 psi	ASTM D695
Compressive Modulus	4.00 GPa	580 ksi	ASTM D695
Poissons Ratio	0.45	0.45	Value linked with measurement setup; ASTM E132
Shear Modulus	1.54 - 1.69 GPa	223 - 245 ksi	Calculated
Izod Impact, Notched	1.40 J/cm	2.62 ft-lb/in	ASTM D256
	11.0 J/cm	20.6 ft-lb/in	ASTM D4812

Thermal Properties	Metric	English	Comments
CTE, linear, Parallel to Flow	31.0 µm/m-°C	17.2 µin/in-°F	TMA; ASTM E831
Thermal Conductivity	0.260 W/m-K	1.80 BTU-in/hr-ft²-°F	ASTM C177
Deflection Temperature at 1.8 MPa (264 psi)	278 °C	532 °F	Unannealed; ASTM D648

Electrical Properties	Metric	English	Comments
Volume Resistivity	2.00e+17 ohm-cm	2.00e+17 ohm-cm	ASTM D257
Surface Resistance	5.00e+18 ohm	5.00e+18 ohm	ASTM D257
Dielectric Constant	3.9 @Frequency 1.00e+6 Hz	3.9 @Frequency 1.00e+6 Hz	ASTM D150
	4.2 @Frequency 60.0 Hz	4.2 @Frequency 60.0 Hz	ASTM D150
Dielectric Strength	23.0 kV/mm	584 kV/in	ASTM D149
Dissipation Factor	0.026 @Frequency 60.0 Hz	0.026 @Frequency 60.0 Hz	ASTM D150
	0.031 @Frequency 1.00e+6 Hz	0.031 @Frequency 1.00e+6 Hz	ASTM D150

Processing Properties	Metric	English
Rear Barrel Temperature	304 °C	579 °F
Nozzle Temperature	371 °C	700 °F
Mold Temperature	199 - 216 °C	390 - 421 °F
Drying Temperature	177 °C	351 °F
Dry Time	3.00 hour	3.00 hour
Moisture Content	0.050 %	0.050 %
Back Pressure	6.89 MPa	999 psi
Screw Speed	50 - 100 rpm	50 - 100 rpm

Descriptive Properties	Value	Comments
Availability	Africa & Middle East
	Asia Pacific
	Europe
	North America
	South America
Features	Ductile
	Flame Retardant
	Good Chemical Resistance
	Good Creep Resistance
	Good Electrical Properties
	Good Wear Resistance
	High Heat Resistance
	High Temperature Strength
	Ultra High Impact Resistance
Forms	Pellets
Generic	PAI
Processing Method	Injection Molding
	Machining
	Profile Extrusion
Screw L/D Ratio	18.0:1.0 to 24.0:1.0
Uses	Electrical/Electronic Applications
	Machine/Mechanical Parts
	Semiconductor Molding Compounds

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