Description: A thermal material constructed of 2 mil aluminum foil coated on both sides with 2 mils of thermally conductive acrylic pressure sensitive adhesive. Recommended uses: It is the standard interface for microprocessor and heat sink applications, ideal where electrical isolation is not a concern. Application advantages: Designed to exhibit excellent thermal properties at 10 psi; High peel strength adhesion to minimize air entrapment; Material can be pre-attached to a heat sink or CPU; Adverse effects of surface roughness are minimzed through a highly conformable pressure-sensitive adhesive; Flame-retardant version available; Available in slit-rolls or die-cut shapes. All data based on a 0.006 inch test sample. Information provided by Saint Gobain Performance Products.