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Rogers Corporation XT/duroid™ 8000 Thermoplastic Laminate, Circuit Material

Category Polymer , Thermoplastic
Manufacturer Rogers Corporation
Trade Name XT/duroid™
Port Ningbo port,China
Trade Terms FOB, CFR, CIF
Payment Terms L/C, T/T, Western Union
Download PDF Rogers Corporation XT/duroid™ 8000 Thermoplastic Laminate, Circuit Material.pdf
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Material Notes:
XT/duroid™ 8000 thermoplastic circuit materials provide an excellent solution for printed circuit board applications used in demanding environmental conditions. XT/duroid 8000 circuit materials are excellent for high frequency/high speed applications. Both dielectric constant and dissipation factor are stable over a wide range of frequencies.XT/duroid 8000 is thermally stable, with a melt temperature higher than PTFE materials and an estimated relative thermal index (RTI) greater than 210°C. The XT/duroid products possess impressive chemical and radiation resistance.Features and Benefits:Stable dielectric constant and dissipation factor over a wide frequency range - High reliability and uniform electrical properties over frequencyHigh maximum operating temperature - suitable for applications where high temperature stability is requiredExcellent chemical resistance - Ease of processing, Resistant to solvents and reagents used to process circuit boards, and Operates in harsh chemical environmentsEnvironmentally friendly - Halogen free/inherently flame retardant, Lead-free solder capable, low smoke/toxicity1/2 oz. very low profile electrodeposited copper foil claddingTypical Applications:Flex-to-install applicationsLightweight feed manifoldsSemiconductor burn-inConformal circuitryOil and gas explorationChip packaging substratesInformation provided by Rogers Corporation.
Physical Properties Metric English Comments
Specific Gravity 1.55 g/cc
1.55 g/cc
ASTM D792
Moisture Absorption at Equilibrium 0.20 %
0.20 %
D24/23; IPC-TM-650 2.6.2.1
Thickness 50.8 microns
2.00 mil
Outgassing - Total Mass Loss 0.010 %
0.010 %
CVCM; ASTM E595
0.090 %
0.090 %
TML; ASTM E595
0.090 %
0.090 %
WVR; ASTM E595
Mechanical Properties Metric English Comments
Tensile Strength 100 MPa
14500 psi
RT; ASTM D638
Elongation at Break 4.0 %
4.0 %
ASTM D638
Tensile Modulus 8.27 GPa
1200 ksi
RT; ASTM D638
Peel Strength 0.877 kN/m
5.00 pli
Copper; IPC-TM-650 2.4.8
Thermal Properties Metric English Comments
CTE, linear 18.0 µm/m-°C

@Temperature 0.000 - 150 °C
10.0 µin/in-°F

@Temperature 32.0 - 302 °F
X-Direction; IPC-TM-650 2.1.41
23.0 µm/m-°C

@Temperature 0.000 - 150 °C
12.8 µin/in-°F

@Temperature 32.0 - 302 °F
Y-Direction; IPC-TM-650 2.1.41
68.0 µm/m-°C

@Temperature 0.000 - 150 °C
37.8 µin/in-°F

@Temperature 32.0 - 302 °F
Z-Direction; IPC-TM-650 2.1.41
Thermal Conductivity 0.350 W/m-K
2.43 BTU-in/hr-ft²-°F
ASTM C518
Maximum Service Temperature, Air >= 200 °C
>= 392 °F
pending UL RTI
Flammability, UL94 V-0

@Thickness 0.0508 mm
V-0

@Thickness 0.00200 in
pending
Electrical Properties Metric English Comments
Volume Resistivity 1.00e+16 ohm-cm
1.00e+16 ohm-cm
Condition A and C96/35/90; IPC 2.5.17.1
Surface Resistance 1.00e+14 ohm
1.00e+14 ohm
Condition A and C96/35/90; IPC 2.5.17.1
Dielectric Constant 3.18 - 3.28

@Frequency 1.00e+10 Hz
3.18 - 3.28

@Frequency 1.00e+10 Hz
Z direction; IPC-TM-650 2.5.5.5.1
Dielectric Strength 177 kV/mm
4500 kV/in
IPC-TM-650 2.5.6.2
Dissipation Factor <= 0.0035

@Frequency 1.00e+10 Hz
<= 0.0035

@Frequency 1.00e+10 Hz
Z direction; IPC-TM-650 2.5.5.5.1
Descriptive Properties Value Comments
Dimensional Stability -0.04
MD; IPC-TM-650, 2.2.4; After bake 120°C
-0.1
CMD; IPC-TM-650, 2.2.4; After bake 120°C
T260 pass
Thermal Coefficient of Dielectric Constant 7 ppm/°C
IPC-TM-650 2.5.5.5.1; -50°C to 150°C
Time to Delamination (T-288) pass
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