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Rogers Corporation RO4450B Prepreg
| Category | Polymer , Thermoset |
| Manufacturer | Rogers Corporation |
| Trade Name | |
| Port | Shanghai port,China |
| Trade Terms | FOB, CFR, CIF |
| Payment Terms | L/C, T/T, Western Union |
| Download PDF | Rogers Corporation RO4450B Prepreg.pdf  |
| Price | EMAIL US sales@lookpolymers.com |
Material Notes:
Prepreg is commonly used to inexpensively form less critical signal layers in antenna designs. A high post-cure Tg makes RO4400 series prepreg an excellent choice for multi-layers requiring sequential laminations as fully cured RO4400 prepregs are capable of handling multiple lamination cycle.Information provided by Rogers Corporation.
| Physical Properties | Metric | English | Comments |
|---|---|---|---|
| Density | 1.80 g/cc | 0.0650 lb/in³ | 3.6 mil thickness; ASTM D792 |
| 1.86 g/cc | 0.0672 lb/in³ | 4.0 mil thickness; ASTM D792 | |
| Moisture Absorption at Equilibrium | 0.010 % @Temperature 50.0 °C, Time 173000 sec |
0.010 % @Temperature 122 °F, Time 48.0 hour |
Immersion, for 3.6 mil thickness grade; ASTM D570 |
| 0.050 % @Temperature 50.0 °C, Time 173000 sec |
0.050 % @Temperature 122 °F, Time 48.0 hour |
Immersion, for 4.0 mil thickness grade; ASTM D570 | |
| Thickness | 91.4 - 102 microns | 3.60 - 4.00 mil | Range of Thicknesses available |
| Mechanical Properties | Metric | English | Comments |
|---|---|---|---|
| Peel Strength | 0.701 kN/m | 4.00 pli | Copper adhesion; 3.6 mil thickness; Z direction; 1/2 oz. EDC After Solder Float; IPC-TM-650 2.4.8 |
| 0.859 kN/m | 4.90 pli | Copper adhesion; 4.0 mil thickness; Z direction; 1/2 oz. EDC After Solder Float; IPC-TM-650 2.4.8 |
| Thermal Properties | Metric | English | Comments |
|---|---|---|---|
| CTE, linear | 17.0 µm/m-°C @Temperature -55.0 - 280 °C |
9.44 µin/in-°F @Temperature -67.0 - 536 °F |
Y Direction; IPC-TM-650 2.4.41 |
| 19.0 µm/m-°C @Temperature -55.0 - 280 °C |
10.6 µin/in-°F @Temperature -67.0 - 536 °F |
X Direction; IPC-TM-650 2.4.41 | |
| 50.0 µm/m-°C @Temperature -55.0 - 280 °C |
27.8 µin/in-°F @Temperature -67.0 - 536 °F |
Z Direction, 4.0 mil thickness; IPC-TM-650 2.4.41 | |
| 60.0 µm/m-°C @Temperature -55.0 - 280 °C |
33.3 µin/in-°F @Temperature -67.0 - 536 °F |
Z Direction, 3.6 mil thickness; IPC-TM-650 2.4.41 | |
| Thermal Conductivity | 0.600 W/m-K @Temperature 80.0 °C |
4.16 BTU-in/hr-ft²-°F @Temperature 176 °F |
Z Direction; ASTM C518 |
| Glass Transition Temp, Tg | >= 280 °C @Temperature -60.0 - 300 °C |
>= 536 °F @Temperature -76.0 - 572 °F |
10°C/min, TGA; IPC-TM-650 2.4.24 |
| Decomposition Temperature | 390 °C | 734 °F | TGA; ASTM D3850 |
| Flammability, UL94 | V-0 | V-0 |
| Electrical Properties | Metric | English | Comments |
|---|---|---|---|
| Volume Resistivity | 9.26e+13 ohm-cm | 9.26e+13 ohm-cm | 50% RH; IPC 2.5.17.1 |
| Dielectric Constant | 3.25 - 3.35 @Frequency 1.00e+10 Hz |
3.25 - 3.35 @Frequency 1.00e+10 Hz |
3.6 mil thickness, Z direction; IPC-TM-650 2.5.5.5 |
| 3.49 - 3.59 @Frequency 1.00e+10 Hz |
3.49 - 3.59 @Frequency 1.00e+10 Hz |
4.0 mil thickness, Z direction; IPC-TM-650 2.5.5.6 | |
| Dielectric Strength | 39.4 kV/mm | 1000 kV/in | Z Direction, 50% RH; IPC-TM-650 2.5.6.2 |
| Dissipation Factor | 0.0040 @Frequency 1.00e+10 Hz |
0.0040 @Frequency 1.00e+10 Hz |
Z direction; IPC-TM-650 2.5.5.5 |
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