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Resinlab® SEC1244 Silver Filled Epoxy Adhesive

Category Polymer , Adhesive , Thermoset , Epoxy , Epoxy Adhesive
Manufacturer Resinlab®
Trade Name
Port Shanghai port,China
Trade Terms FOB, CFR, CIF
Payment Terms L/C, T/T, Western Union
Download PDF Resinlab® SEC1244 Silver Filled Epoxy Adhesive.pdf
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Material Notes:
Resinlab™ SEC1244 is a silver filled, two component, elevated temperature curing epoxy adhesive. It provides excellent electrical conductivity useful in many electronic applications. It is a smooth 100% solids thixotropic solvent free paste provided in a 1:1 weight ratio. This product can cure very quickly at high temperatures. 5 minutes at 150°C, 15 minutes at 120°C or 60 minutes at 100°C can be used as guides to determining optimum processing conditions. SEC1244 provides the additional benefit of very high thermal conductivity due to its high loading of pure silver. Alloys are not used as they have been proven to be less reliable. It gives good environmental protection while having tenacious adhesion to various metals and other common assembly materials.Information Provided by Resinlab L.L.C., an Ellsworth Adhesives Company.
Physical Properties Metric English Comments
Specific Gravity 3.90 g/cc
3.90 g/cc
Mixed; TM R050-16
Water Absorption <= 0.20 %

@Time 86400 sec
<= 0.20 %

@Time 24.0 hour
TM R050-35
Viscosity 51500 cP
51500 cP
10.0 rpm; TM R050-12
126000 cP
126000 cP
5.0 rpm; TM R050-12
234000 cP
234000 cP
Mixed, 2.5 rpm; TM R050-12
Mechanical Properties Metric English Comments
Hardness, Shore D 80
80
TM R050-17
Tensile Strength at Break 34.5 MPa
5000 psi
TM R050-36
Tensile Strength, Ultimate 34.5 MPa
5000 psi
TM R050-36
Tensile Strength, Yield 24.1 MPa
3500 psi
TM R050-36
Elongation at Break 1.0 - 2.0 %
1.0 - 2.0 %
TM R050-36
Tensile Modulus 4.14 GPa
600 ksi
TM R050-36
Compressive Yield Strength 72.4 MPa
10500 psi
TM R050-38
Compressive Strength 86.2 MPa
12500 psi
Break; TM R050-38
93.1 MPa
13500 psi
Ultimate; TM R050-38
Compressive Modulus 5.17 GPa
750 ksi
TM R050-38
Adhesive Bond Strength 3.45 MPa
500 psi
Lap shear; 2024 T3 Al Abraded / MEK Wipe; TM R050-37
Thermal Properties Metric English Comments
CTE, linear 51.5 µm/m-°C

@Temperature <=99.0 °C
28.6 µin/in-°F

@Temperature <=210 °F
below Tg
101.4 µm/m-°C

@Temperature >=99.0 °C
56.33 µin/in-°F

@Temperature >=210 °F
above Tg
Thermal Conductivity 2.19 W/m-K
15.2 BTU-in/hr-ft²-°F
Maximum Service Temperature, Air 150 °C
302 °F
Minimum Service Temperature, Air -40.0 °C
-40.0 °F
Glass Transition Temp, Tg 99.0 °C
210 °F
TM R050-25
Electrical Properties Metric English Comments
Volume Resistivity 0.00060 ohm-cm
0.00060 ohm-cm
Cured: 15 minutes at 25°C
Processing Properties Metric English Comments
Cure Time 5.00 min

@Temperature 150 °C
0.0833 hour

@Temperature 302 °F
60.0 min

@Temperature 100 °C
1.00 hour

@Temperature 212 °F
Pot Life >= 1440 min
>= 1440 min
Mass: 50g; TM R050-19
Descriptive Properties Value Comments
Color Silver
Mix Ratio 1:1
Weight
109:100
Volume
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