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Resinlab® EP965SC-7 Black Unfilled Electronic Grade Epoxy Encapsulant

Category Polymer , Thermoset , Epoxy , Epoxy Cure Resin , Epoxy Encapsulant, Unreinforced
Manufacturer Resinlab®
Trade Name
Port Shanghai port,China
Trade Terms FOB, CFR, CIF
Payment Terms L/C, T/T, Western Union
Download PDF Resinlab® EP965SC-7 Black Unfilled Electronic Grade Epoxy Encapsulant.pdf
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Material Notes:
Resinlab™ EP965SC-7 Black is a two part unfilled electronic grade epoxy encapsulant designed for medium sized castings. It cures at room temperature to a tough, semi-rigid polymer. It has good wetting and adhesion to most surfaces and is free flowing to penetrate voids and give good air release and a smooth high gloss surface. It has very good resistance to water, acids and bases and most organic solvents. It was especially formulated to a 1A:1B volume mix ratio for use in side-by-side dispensing cartridges and meter/mix and dispense equipment. EP965SC-7 Black will reach full cure at room temperature within 24 hours. Cure time can be accelerated by the application of heat after product has gelled. Times and temperatures from 1 hour at 65°C to 20 minutes at 110°C are typical for small castings (less than 50 grams).Information Provided by Resinlab L.L.C., an Ellsworth Adhesives Company.
Physical Properties Metric English Comments
Specific Gravity 0.980 g/cc
0.980 g/cc
Part B; TM R050-16
1.07 g/cc
1.07 g/cc
Mixed; TM R050-16
1.16 g/cc
1.16 g/cc
Part A; TM R050-16
Water Absorption 0.43 %

@Time 86400 sec
0.43 %

@Time 24.0 hour
TM R050-35
Viscosity 3000 cP
3000 cP
Part B, RVT, #5, 20 rpm; TM R050-12
8000 cP
8000 cP
Mixed; TM R050-12
16000 cP
16000 cP
Part A, RVT, #6, 20 rpm; TM R050-12
Mechanical Properties Metric English Comments
Hardness, Shore D 80
80
TM R050-17
Tensile Strength at Break 46.9 MPa
6800 psi
TM R050-36
Tensile Strength, Ultimate 51.7 MPa
7500 psi
TM R050-36
Tensile Strength, Yield 27.6 MPa
4000 psi
TM R050-36
Elongation at Break 3.0 - 6.0 %
3.0 - 6.0 %
TM R050-36
Tensile Modulus 2.59 GPa
375 ksi
TM R050-36
Compressive Yield Strength 58.6 MPa
8500 psi
TM R050-38
Compressive Strength 148 MPa
21500 psi
Ultimate; TM R050-38
148 MPa
21500 psi
Break; TM R050-38
Compressive Modulus 1.38 GPa
200 ksi
TM R050-38
Adhesive Bond Strength 17.2 MPa
2500 psi
Lap shear; 2024 T3 Al Abraded / MEK Wipe; TM R050-37
Thermal Properties Metric English Comments
CTE, linear 50.0 µm/m-°C
27.8 µin/in-°F
Thermal Conductivity 0.140 W/m-K
0.972 BTU-in/hr-ft²-°F
Maximum Service Temperature, Air 150 °C
302 °F
Minimum Service Temperature, Air -40.0 °C
-40.0 °F
Glass Transition Temp, Tg 68.0 °C
154 °F
TM R050-25
Electrical Properties Metric English Comments
Volume Resistivity 8.00e+14 ohm-cm
8.00e+14 ohm-cm
Dielectric Constant 4.2

@Frequency 100 Hz,
Temperature 25.0 °C
4.2

@Frequency 100 Hz,
Temperature 77.0 °F
Dielectric Strength 16.1 kV/mm
410 kV/in
Processing Properties Metric English Comments
Pot Life 45 - 60 min
45 - 60 min
Mass: 50g; TM R050-19
Descriptive Properties Value Comments
Color Black
Mix Ratio 1:1
Volume
100:85
Weight
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