Songhan Plastic Technology Co.,Ltd.

Reltek BONDiT™ B-521 Adhesive, Sealant & Potting System

Category Polymer , Adhesive , Thermoset
Manufacturer Reltek LLC
Trade Name BONDiT™
Port Shanghai port,China
Trade Terms FOB, CFR, CIF
Payment Terms L/C, T/T, Western Union
Download PDF Reltek BONDiT™ B-521 Adhesive, Sealant & Potting System.pdf
  Online Service   lookpolymers   27660005
Material Notes:
Key Properties: Outstanding for bonding dissimilar materials with high thermal expansion differential applications.Fast thermal cure, long pot life.Ease of use.Applications: Excellent for fast assembly of dissimilar materials with large differentials in thermal expansion, such as glass to acrylic. Bonds most plastics, metals, glass, and ceramics. Cure 10 minutes at 170°F.
Physical Properties Metric English Comments
Viscosity 2500 cP
2500 cP
Descriptive Properties Value Comments
Color Slight haze
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