Premix Thermoplastics PREFLEX E25 Polyphenylene Ether (PPO/PPE)

PREFLEX films combine outstanding dielectric properties, good heat stability, low water absorption and chemical resistance in a way not available before. Also rigid boards made of the same material are available and marketed under the name PREBOARD. Thus the same material can also be used in rigid/flex boards. The material lends itself also well for injection moulding and is available for that purpose in granules sold under the name PREPERM. This enables the production of 3D circuit boards. Key features: Low dissipation factorLow dielectric constant Low water absorptionHigh TgZero shrinkage even at 190°CLow CTE in all directionsExcellent adhesion with inks and adhesivesExcellent chemical resistanceMinimum thicknesses below 10 micronsRecyclable and RoHS compliantNon halogen flame retardant grades also availableApplications: Flexible printed circuits, printed electronics, fuel cells and other uses calling for a special film.Information from Premix OY