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Permabond ET500 Epoxy Resin

Category Polymer , Adhesive , Thermoset , Epoxy , Epoxy Adhesive
Manufacturer Permabond
Trade Name
Port Shanghai port,China
Trade Terms FOB, CFR, CIF
Payment Terms L/C, T/T, Western Union
Download PDF Permabond ET500 Epoxy Resin.pdf
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Material Notes:
PERMABOND ET500 is a two-part fast-setting epoxy adhesive which bonds to a wide variety of substrates such as wood, metal, ceramics and some plastics and composites. It cures rapidly at room temperature to give handling strength in approximately 5 minutes. This product is ideal for general purpose bonding. It is typically used for small component assembly and is suitable for applications that require a clear bond line. Features & Benefits: Fast setting Full cure at room temperature Adhesion to a variety of substrates Information provided by Permabond.
Physical Properties Metric English Comments
Specific Gravity 1.12 g/cc
1.12 g/cc
ET500B, Amine Hardener
1.17 g/cc
1.17 g/cc
ET500A, Epoxy Resin
Viscosity 12000 cP

@Temperature 25.0 °C
12000 cP

@Temperature 77.0 °F
ET500A, Epoxy Resin
22500 cP

@Temperature 25.0 °C
22500 cP

@Temperature 77.0 °F
ET500B, Amine Hardener
Storage Temperature 5.00 - 25.0 °C
41.0 - 77.0 °F
Mechanical Properties Metric English Comments
Hardness, Shore D 73
73
Elongation at Break 7.0 %
7.0 %
Adhesive Bond Strength 12.0 - 14.0 MPa
1740 - 2030 psi
Mild steel, Shear
Thermal Properties Metric English Comments
Maximum Service Temperature, Air 80.0 °C
176 °F
Minimum Service Temperature, Air -40.0 °C
-40.0 °F
Glass Transition Temp, Tg 40.0 °C
104 °F
Processing Properties Metric English Comments
Cure Time 4.00 - 6.00 min
0.0667 - 0.100 hour
handling time
1440 min
24.0 hour
full cure
Pot Life 3.00 - 4.00 min

@Temperature 20.0 °C
3.00 - 4.00 min

@Temperature 68.0 °F
Shelf Life 12.0 Month
12.0 Month
Descriptive Properties Value Comments
Appearance Colorless
Uncured
Maximum Gap Fill (mm) 2
Strength Retention 10% at 150°C
Relative to 0°C
100% at 0°C
Relative to 0°C
30% at 100°C
Relative to 0°C
93% at 50°C
Relative to 0°C
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