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Parker Chomerics Tecknit® 72-00008 Silver-Filled Epoxy System

Category Polymer , Thermoset , Epoxy , Epoxy Cure Resin
Manufacturer Parker Chomerics
Trade Name Tecknit®
Port Shanghai port,China
Trade Terms FOB, CFR, CIF
Payment Terms L/C, T/T, Western Union
Download PDF Parker Chomerics Tecknit® 72-00008 Silver-Filled Epoxy System.pdf
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Material Notes:
Description: This commercial grade, conductive epoxy is designed for use in bonding applications where good conductivity is required. When mixed in a ratio of 1:1.4 by volume or weight, the two components produce a light colored creamy paste which can be easily applied.Information provided by Chomerics
Mechanical Properties Metric English Comments
Shear Strength >= 6.89 MPa
>= 999 psi
Cured; ASTM D1002
Thermal Properties Metric English Comments
Maximum Service Temperature, Air 149 °C
300 °F
Cured
Minimum Service Temperature, Air -62.0 °C
-79.6 °F
Cured
Shrinkage <= 1.0 %
<= 1.0 %
Cured
Electrical Properties Metric English Comments
Volume Resistivity <= 0.020 ohm-cm
<= 0.020 ohm-cm
Cured; QAP-1017
Processing Properties Metric English Comments
Cure Time 30.0 min

@Temperature 100 °C
0.500 hour

@Temperature 212 °F
Recommended Cure
Pot Life 45 min

@Temperature 25.0 °C
45 min

@Temperature 77.0 °F
Shelf Life 15.0 Month
15.0 Month
Unopened Container
Descriptive Properties Value Comments
Color Silver Gray
Consistency Thick Paste
Filler Ag/Glass
Final Condition Rigid
Mix Ratio 1:1.4
Number of Components Two
Resin Epoxy
Volume 14.7 in3
Weight 16 oz
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