Songhan Plastic Technology Co.,Ltd.

Parker Chomerics THERMATTACH® T414 Thermally Conductive Attachment Tape

Category Polymer , Tape
Manufacturer Parker Chomerics
Port Shanghai port,China
Trade Terms FOB, CFR, CIF
Payment Terms L/C, T/T, Western Union
Download PDF Parker Chomerics THERMATTACH® T414 Thermally Conductive Attachment Tape.pdf
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Material Notes:
Description: THERMATTACH® double-sided thermal interface tapes provide exceptional bonding properties between electronic components and heat sinks, eliminating and need for mechanical fasteners. THERMATTACH® tapes are proven to offer excellent reliability when exposed to thermal, mechanical, and environmental conditioning.Features/Benefits: Offered in various forms to provide thermal, dielectric, and flame retardant properties; Offered in custom die-cut configurations to suit a variety of applications; Eliminate the need for mechanical attachment (i.e. screws, clips, rivets, fasteners); Proven reliability under various mechanical, thermal, and environmental stresses; Embossed version available; Meets RoHS specifications; No curing required, unlike epoxy or acrylic performs or liquid systems and Easily reworkableTypical Applications: Mount heat sinks to components dissipating < -25 W; Attach heat sinks to PC (esp. graphics) processors; Heat sink attachment to motor control processors and Telecommunication infrastructure components.Product Attributes: Excellent dielectric strength due to polyimide carrier and Good thermal performanceInformation provided by Chomerics
Physical Properties Metric English Comments
Thickness 102 - 152 microns
4.02 - 5.98 mil
Outgassing - Total Mass Loss 0.020 %
0.020 %
0.56 %
0.56 %
Mechanical Properties Metric English Comments
Adhesive Bond Strength 0.130 MPa
18.9 psi
400 psi attachment; 2 hour sample dwell time 25°C; Chomerics #54
0.689 MPa

@Temperature 25.0 °C
99.9 psi

@Temperature 77.0 °F
Lap AL-Al; ASTM D1002
Peel Strength 0.0260 kN/m
0.148 pli
90°; to 0.002" aluminum foil; ASTM D1000
Thermal Properties Metric English Comments
CTE, linear 300 µm/m-°C
167 µin/in-°F
Adhesive; ASTM D3386
Thermal Conductivity 0.400 W/m-K
2.78 BTU-in/hr-ft²-°F
ASTM D5470
Maximum Service Temperature, Air 125 °C
257 °F
Minimum Service Temperature, Air -30.0 °C
-22.0 °F
Glass Transition Temp, Tg -30.0 °C
-22.0 °F
ASTM D1356
Flammability, UL94 V-0
Electrical Properties Metric English Comments
Volume Resistivity 3.00e+14 ohm-cm
3.00e+14 ohm-cm
Dielectric Breakdown 500 V
500 V
Processing Properties Metric English Comments
Shelf Life 12.0 Month
12.0 Month
From date of manufacture; Chomerics
Descriptive Properties Value Comments
Carrier Filled Polyimide
Color Beige
Creep Adhesion 125°C; PSTC-7
15°C; PSTC-7
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