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Parker Chomerics THERM-A-GAP™ GEL 30 High Performance Fully Cured Dispensable Gel

Category Fluid
Manufacturer Parker Chomerics
Trade Name THERM-A-GAP™ GEL
Port Ningbo port,China
Trade Terms FOB, CFR, CIF
Payment Terms L/C, T/T, Western Union
Download PDF Parker Chomerics THERM-A-GAP™ GEL 30 High Performance Fully Cured Dispensable Gel.pdf
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Material Notes:
Description: Parker Chomerics fully cured dispensable GELs eliminate time consuming hand assembly, decreasing installation costs and reducing customer manufacturing and purchasing (logistical) complexity. These products require no mixing or curing, providing superior design flexibility. Provides low thermal impedance at thin and thick gaps, allowing use of common heat spreaders: Lower temperature increases product life, typically a doubling of life based on every 10°C decrease in temperature; Deflects easily under very low compressive forces, decreasing stress on components thus decreasing component failures.Typical Applications: Automotive Electronic Control Units (ECU’s), Power Supplies & Semiconductors, Memory & Power Modules, Microprocessors/Graphics Processors, and Flat Panel Displays & Consumer Electronics.Features/Benefits: Easily dispensable, Fully-cured/No pump out, High bulk thermal conductivity, Low thermal impedance, Ultra low compression force, High tack surface & reworkable and Proven long-term reliability.Product Attributes: Accommodates a variety of bond line thicknesses for application to multiple devices, Moderate bondline gel (approximately 4-40+ mils), High bulk thermal conductivity, Excellent performance-to-price, Compatible with high volume, automated dispense processes, and Meets Telcordia (Bellcore) silicone specifications.Information provided by Chomerics
Physical Properties Metric English Comments
Specific Gravity 3.20 g/cc
3.20 g/cc
ASTM D792
Thickness >= 100 microns
>= 3.94 mil
Bondline thickness
Deformation 22 %

@Pressure 0.00345 MPa
22 %

@Pressure 0.500 psi
Dispensed 1.0 cc of material, Brought 1" x 1" probe down to 0.1"; Test rate 0.025 in/min; Modified ASTM C165
41 %

@Pressure 0.00689 MPa
41 %

@Pressure 1.00 psi
Dispensed 1.0 cc of material, Brought 1" x 1" probe down to 0.1"; Test rate 0.025 in/min; Modified ASTM C165
47 %

@Pressure 0.0103 MPa
47 %

@Pressure 1.50 psi
Dispensed 1.0 cc of material, Brought 1" x 1" probe down to 0.1"; Test rate 0.025 in/min; Modified ASTM C165
52 %

@Pressure 0.0138 MPa
52 %

@Pressure 2.00 psi
Dispensed 1.0 cc of material, Brought 1" x 1" probe down to 0.1"; Test rate 0.025 in/min; Modified ASTM C165
54 %

@Pressure 0.0172 MPa
54 %

@Pressure 2.50 psi
Dispensed 1.0 cc of material, Brought 1" x 1" probe down to 0.1"; Test rate 0.025 in/min; Modified ASTM C165
56 %

@Pressure 0.0207 MPa
56 %

@Pressure 3.00 psi
Dispensed 1.0 cc of material, Brought 1" x 1" probe down to 0.1"; Test rate 0.025 in/min; Modified ASTM C165
59 %

@Pressure 0.0241 MPa
59 %

@Pressure 3.50 psi
Dispensed 1.0 cc of material, Brought 1" x 1" probe down to 0.1"; Test rate 0.025 in/min; Modified ASTM C165
Outgassing - Total Mass Loss 0.050 %
0.050 %
CVCM; ASTM E595
0.15 %
0.15 %
TML; ASTM E595
Thermal Properties Metric English Comments
CTE, linear 150 µm/m-°C
83.3 µin/in-°F
ASTM E831
Specific Heat Capacity 1.00 J/g-°C
0.239 BTU/lb-°F
ASTM E1269
Thermal Conductivity 3.50 W/m-K
24.3 BTU-in/hr-ft²-°F
ASTM D5470
Maximum Service Temperature, Air 200 °C
392 °F
Minimum Service Temperature, Air -55.0 °C
-67.0 °F
Flammability, UL94 V-0
V-0
Electrical Properties Metric English Comments
Volume Resistivity 1.00e+14 ohm-cm
1.00e+14 ohm-cm
ASTM D257
Dielectric Constant 7.0

@Frequency 1.00e+6 Hz
7.0

@Frequency 1.00e+6 Hz
ASTM D150
Dielectric Strength 8.00 kV/mm
203 kV/in
ASTM D149
Dissipation Factor 0.0020

@Frequency 100000 Hz
0.0020

@Frequency 100000 Hz
Chomerics
Processing Properties Metric English Comments
Shelf Life 18.0 Month
18.0 Month
From date of Manufacture
Descriptive Properties Value Comments
Color Light Pink
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