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Parker Chomerics THERM-A-FORM T644 Cure-in-Place Potting and Underfill Material

Category Polymer , Thermoset , Silicone
Manufacturer Parker Chomerics
Trade Name THERM-A-FORM
Port Shanghai port,China
Trade Terms FOB, CFR, CIF
Payment Terms L/C, T/T, Western Union
Download PDF Parker Chomerics THERM-A-FORM T644 Cure-in-Place Potting and Underfill Material.pdf
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Material Notes:
Description: THERM-A-FORM™ thermally conductive silicone elastomer products are dispensable form-in-place compounds designed for heat transfer without excessive compressive force in electronics cooling applications. These versatile liquid reactive materials can be dispensed and cured into complex geometries for cooling of multi-height components on a PCB without the expense of a molded sheet. Each compound is available in ready-to-use cartridge systems, eliminating weighing, mixing, and degassing procedures.Product Attributes: Very low modulus material for transferring heat from fragile electronic componentInformation provided by Chomerics
Physical Properties Metric English Comments
Specific Gravity 1.45 g/cc
1.45 g/cc
ASTM D792
Viscosity 2.5 cP
2.5 cP
ASTM D2196
Outgassing - Total Mass Loss 0.29 %
0.29 %
CVCM; ASTM D595
0.39 %
0.39 %
TML; ASTM D595
Mechanical Properties Metric English Comments
Hardness, Shore A 15
15
ASTM D2240
Thermal Properties Metric English Comments
CTE, linear 300 µm/m-°C
167 µin/in-°F
ASTM E831
Specific Heat Capacity 1.00 J/g-°C
0.239 BTU/lb-°F
ASTM E1269
Thermal Conductivity 1.20 W/m-K
8.33 BTU-in/hr-ft²-°F
ASTM D5470
Maximum Service Temperature, Air 150 °C
302 °F
Minimum Service Temperature, Air -50.0 °C
-58.0 °F
Brittleness Temperature -55.0 °C
-67.0 °F
ASTM D2137
Electrical Properties Metric English Comments
Volume Resistivity 1.00e+13 ohm-cm
1.00e+13 ohm-cm
ASTM D257
Dielectric Constant 4.0

@Frequency 1.00e+6 Hz
4.0

@Frequency 1.00e+6 Hz
ASTM D150
Dielectric Strength 20.0 kV/mm
508 kV/in
ASTM D149
Dissipation Factor 0.0010

@Frequency 1.00e+6 Hz
0.0010

@Frequency 1.00e+6 Hz
Chomerics
Processing Properties Metric English Comments
Cure Time 3.00 min

@Temperature 150 °C
0.0500 hour

@Temperature 302 °F
60.0 min

@Temperature 60.0 °C
1.00 hour

@Temperature 140 °F
4320 min

@Temperature 23.0 °C
72.0 hour

@Temperature 73.4 °F
Pot Life 360 min

@Temperature 23.0 °C
360 min

@Temperature 73.4 °F
2X Starting Viscosity
Shelf Life 3.00 Month
3.00 Month
From date of Manufacture
Descriptive Properties Value Comments
Binder Silicone
Color Pink
Extractable Silicone 1-2%
Filler Boron Nitride
Mix Ratio 1:1
Number of Components 2-part
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