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Parker Chomerics ECOPLATE™ 5030

Category Metal
Manufacturer Parker Chomerics
Trade Name ECOPLATE™
Port Ningbo port,China
Trade Terms FOB, CFR, CIF
Payment Terms L/C, T/T, Western Union
Download PDF Parker Chomerics ECOPLATE™ 5030.pdf
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Material Notes:
Description: ECOPLATE™ 5030 is a pure metal wire with a metallurgical composition free of defects or contaminates. When applied with the automated ECOPLATE process, it conforms to the substrate much like paint, but with the superior EMI shielding performance of solid metal. This highly engineered laminar film has low porosity and oxidation, and require no curing or further process.Adhesion: Adhesion of the ECOPLATE™ 5030 allow is excellent with standard plastics and metals used in electronic device parts and housings. These include PC. ABS, PC/ABS, polysulfone and other thermoset or thermoplastic injection molded polymer; and aluminum, magnesium and zinc die-cast alloys. Its corrosion resistance makes ECOPLATE™ 5030 material an excellent choice for ensuring the long-term conductivity of metallic housings.Compatibility: Following application, ECOPLATE™ 5030 material withstands low temperature solder operations, such as soldering of a shielded grounding cable onto connector back shells. The ECOPLATE™ alloy surface also functions as a replacement for plating or metallization of parts in preparation for robotic dispensing of Cho-Form® form-in-place gasketing.Information provided by Chomerics
Thermal Properties Metric English Comments
Melting Point 270 °C
518 °F
Maximum Service Temperature, Air 200 °C
392 °F
Electrical Properties Metric English Comments
Surface Resistivity per Square 0.0050 ohm

@Thickness 0.0300 mm
0.0050 ohm

@Thickness 0.00118 in
Chomerics 95-40-5104
Shielding Effectiveness 75 dB

@Frequency 1.00e+10 Hz
75 dB

@Frequency 1.00e+10 Hz
CHO-TM-TP08
90 dB

@Frequency 1.00e+8 Hz
90 dB

@Frequency 1.00e+8 Hz
CHO-TM-TP08
90 dB

@Frequency 5.00e+8 Hz
90 dB

@Frequency 5.00e+8 Hz
CHO-TM-TP08
90 dB

@Frequency 2.00e+9 Hz
90 dB

@Frequency 2.00e+9 Hz
CHO-TM-TP08
Descriptive Properties Value Comments
Adhesion 5B
ASTM D3359-78 Method B
Alloy Ratio 80/20
Composition Tin/Zinc
Film Porosity <6%
Typical Film Build 0.0005 - 0.0015 in
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