Parker Chomerics CHO-FOIL CCD Shielding Tape

Category	Polymer , Adhesive , Tape
Manufacturer	Parker Chomerics
Trade Name	CHO-FOIL
Port	Ningbo port,China
Trade Terms	FOB, CFR, CIF
Payment Terms	L/C, T/T, Western Union
Download PDF	Parker Chomerics CHO-FOIL CCD Shielding Tape.pdf
Price	EMAIL US sales@lookpolymers.com
	Online Service lookpolymers 27660005

Material Notes:

Conductive Adhesive Copper FoilDescription: Chomerics’ CHO-FOIL® tapes are an economical EMI shielding solution for a variety of commercial uses. The tapes are available in copper, aluminum, or tinned copper foil backed with Chomerics’ highly conductive pressure-sensitive adhesive.Typical Applications: Provide a low impedance connection between a braided cable shield and the metal connector backshell in molded cables. An effective EMI shielded assembly can be achieved without soldering the tape to the braid or backshell; EMI radiation measurement troubleshooting, using CHO-FOIL tape to shield ventilation slots or seam gaps; Provide electrical continuity in seams of EMI shielded rooms and electronic enclosures; Supply electrical contact to surfaces that can’t be soldered to, such as conductive plastic or aluminum; EMI shield for cables by wrapping the tape around the cable. An overlap is recommended; ESD shielding; Provide corrosion-resistant ground contact points; Fabric tape available where weight and flexibility are important, such as for wrapping cables. Information provided by Chomerics

Physical Properties	Metric	English	Comments
Thickness	35.6 microns	1.40 mil	Foil thickness
	76.2 microns	3.00 mil	Adhesive thickness (2-sided)
	112 microns	4.40 mil	Total

Mechanical Properties	Metric	English	Comments
Peel Strength	0.526 kN/m	3.00 pli	Initial; ASTM D1000
	0.859 kN/m @Temperature 85.0 °C	4.90 pli @Temperature 185 °F	95% RH; ASTM D1000
	0.771 kN/m @Temperature 121 °C, Time 605000 sec	4.40 pli @Temperature 250 °F, Time 168 hour	ASTM D1000
	0.806 kN/m @Temperature 85.0 °C, Time 605000 sec	4.60 pli @Temperature 185 °F, Time 168 hour	ASTM D1000
	0.684 kN/m @Time 605000 sec	3.90 pli @Time 168 hour	Salt fog corrosion; ASTM D1000

Thermal Properties	Metric	English	Comments
Maximum Service Temperature, Air	205 °C	401 °F
Minimum Service Temperature, Air	-40.0 °C	-40.0 °F

Electrical Properties	Metric	English	Comments
Surface Resistance	<= 0.015 ohm	<= 0.015 ohm	Initial through resistivity (TR); CHO-TP-57
	<= 0.115 ohm @Temperature 85.0 °C	<= 0.115 ohm @Temperature 185 °F	95% RH; (TR); CHO-TP-57
	<= 0.0030 ohm @Temperature 121 °C, Time 605000 sec	<= 0.0030 ohm @Temperature 250 °F, Time 168 hour	(TR); CHO-TP-57
	<= 0.0070 ohm @Temperature 85.0 °C, Time 605000 sec	<= 0.0070 ohm @Temperature 185 °F, Time 168 hour	(TR); CHO-TP-57
	<= 0.275 ohm @Time 605000 sec	<= 0.275 ohm @Time 168 hour	Salt fog corrosion; (TR); CHO-TP-57
Surface Resistivity per Square	<= 0.010 ohm	<= 0.010 ohm	[ohm/in<sup>2<sup>]; <.0016 ohm/cm<sup>2</sup>; MIL-STD-202C

Descriptive Properties	Value	Comments
Adhesion to Aluminum	>40 oz./inch	ASTM D1000
Adhesive Type	Electrically Conductive, Pressure-Sensitive Acrylic
Flame Resistance (UL Subject 510)	Meets
Foil/Fabric Type	1 oz. RA Copper

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