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Parker Chomerics CHO-BOND 589-29 Conductive Epoxy

Category Polymer , Adhesive , Thermoset , Epoxy , Epoxy, Electrically Conductive
Manufacturer Parker Chomerics
Trade Name CHO-BOND
Port Ningbo port,China
Trade Terms FOB, CFR, CIF
Payment Terms L/C, T/T, Western Union
Download PDF Parker Chomerics CHO-BOND 589-29 Conductive Epoxy.pdf
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Material Notes:
Low cost, highly conductive adhesive system which combines the strong adhesion characteristics of an epoxy with the superior conductivity of silver. CHO-BOND 589-29 adhesive meets the most exacting electrical requirements without the high temperatures, fluxes and expensive preparatory techniques usually required for conventional solder systems.Information provided by Chomerics
Physical Properties Metric English Comments
Specific Gravity 2.20 - 2.80 g/cc
2.20 - 2.80 g/cc
Solids Content 100 %
100 %
Thickness 254 microns
10.0 mil
Recommended
Mechanical Properties Metric English Comments
Shear Strength >= 4.48 MPa
>= 650 psi
9.66 MPa

@Temperature 116 °C,
Time 900 sec
1400 psi

@Temperature 240 °F,
Time 0.250 hour
Lap
Thermal Properties Metric English Comments
Maximum Service Temperature, Air 125 °C
257 °F
Minimum Service Temperature, Air -55.0 °C
-67.0 °F
Electrical Properties Metric English Comments
Volume Resistivity 0.050 ohm-cm
0.050 ohm-cm
R.T. cure
<= 0.0020 ohm-cm

@Temperature 116 °C,
Time 900 sec
<= 0.0020 ohm-cm

@Temperature 240 °F,
Time 0.250 hour
DC
Processing Properties Metric English Comments
Cure Time 15.0 min

@Temperature 116 °C
0.250 hour

@Temperature 241 °F
1440 min

@Temperature 24.0 °C
24.0 hour

@Temperature 75.2 °F
Shelf Life 9.00 Month
9.00 Month
Descriptive Properties Value Comments
Binder Epoxy
Color Silver
Consistency Thin Paste
Coverage 156.1 cm2/g
Filler AG
Mix Ratio 7 to 100
Work Life 0.5 hr
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