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Parker Chomerics CHO-BOND® 584-29 SYRINGE-PAK™ Silver Filled Conductive Epoxy and Hardener

Category Polymer , Adhesive , Thermoset , Epoxy , Epoxy Adhesive
Manufacturer Parker Chomerics
Trade Name CHO-BOND®
Port Shanghai port,China
Trade Terms FOB, CFR, CIF
Payment Terms L/C, T/T, Western Union
Download PDF Parker Chomerics CHO-BOND® 584-29 SYRINGE-PAK™ Silver Filled Conductive Epoxy and Hardener.pdf
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Material Notes:
Description: Chomerics CHO-BOND 584-29 is a two-component, highly conductive adhesive system that combines the strong adhesive characteristics of epoxy with the superior conductivity of pure silver. This new syringe system simplifies the mixing of resin and hardening components, and improves dispensing accuracy and efficiency. This result is less compound waste and lower applied cost.Features: Easy and efficient application system; Pure silver filler. Superior conductivity; 100% solids, no VOC’s and Room temperature cure in 24 hoursInformation provided by Chomerics
Physical Properties Metric English Comments
Specific Gravity 2.20 g/cc
2.20 g/cc
ASTM D792
Mechanical Properties Metric English Comments
Shear Strength >= 8.27 MPa
>= 1200 psi
Lap; ASTM D1022
Electrical Properties Metric English Comments
Volume Resistivity 0.0020 ohm-cm
0.0020 ohm-cm
Chomerics 95-40-5101 and 95-40-5102
Processing Properties Metric English Comments
Cure Time 15.0 min

@Temperature 113 °C
0.250 hour

@Temperature 235 °F
Shelf Life 9.00 Month

@Temperature 24.0 °C
9.00 Month

@Temperature 75.2 °F
Descriptive Properties Value Comments
Filler Ag
Mix Ratio 0.069
Work Life 0.5 hrs
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