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Parker Chomerics CHO-BOND 4041 Part B Conductive Adhesive

Category Polymer , Adhesive , Thermoset
Manufacturer Parker Chomerics
Trade Name CHO-BOND
Port Shanghai port,China
Trade Terms FOB, CFR, CIF
Payment Terms L/C, T/T, Western Union
Download PDF Parker Chomerics CHO-BOND 4041 Part B Conductive Adhesive.pdf
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Material Notes:
Information provided by Chomerics
Physical Properties Metric English Comments
Specific Gravity >= 1.00 g/cc
>= 1.00 g/cc
Thermal Properties Metric English Comments
Flash Point >= 93.3 °C
>= 200 °F
Component Elements Properties Metric English Comments
Copper, Cu >= 75 %
>= 75 %
Silver, Ag <= 20 %
<= 20 %
Descriptive Properties Value Comments
Color Silver
Physical Form Silver paste mild odor
Silicone Resin % <10
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