Park Electrochemical Nelco® N7000-1 Polyimide Laminate and Prepreg

Category	Polymer , Thermoset , Polyimide, TS
Manufacturer	Park Electrochemical Corp.
Trade Name	Nelco®
Port	Ningbo port,China
Trade Terms	FOB, CFR, CIF
Payment Terms	L/C, T/T, Western Union
Download PDF	Park Electrochemical Nelco® N7000-1 Polyimide Laminate and Prepreg.pdf
Price	EMAIL US sales@lookpolymers.com
	Online Service lookpolymers 27660005

Material Notes:

The Nelco N7000-1 series of polyimide laminate and prepreg has alow Z-axis expansion and high Tg offering PCB manufacturers consistent board performance and reliability. N7000-1 is a good choice for applications requiring the superior thermal stability and chemical resistance provided by a polyimide.Key Features and Benefits:Polyimide resin chemistryLead-free assembly compatibilitySupports current and previous military and industrial standardsReliable plated-through holesProven processing and performanceApplications/Qualifications:Fine-Line MultilayersBackplanesSurface-Mount MultilayersBGA MultilayersMCM-LsDirect Chip AttachHigh Speed ComputingBurn-in BoardsInformation provided by Park Electrochemical Corp.

Physical Properties	Metric	English	Comments
Density	1.68 g/cc	0.0607 lb/in³	50% Resin Content; Internal Method
Water Absorption	0.35 %	0.35 %	IPC-TM-650.2.6.2.1

Mechanical Properties	Metric	English	Comments
Modulus of Elasticity	26.9 GPa	3900 ksi	X; ASTM D3039
	26.9 GPa	3900 ksi	Y; ASTM D3039
Poissons Ratio	0.12	0.12	X; ASTM D3039
	0.12	0.12	Y; ASTM D3039
Peel Strength	1.05 kN/m	6.00 pli	at elevated temperature; IPC-TM-650.2.4.8.2a
	1.23 kN/m	7.00 pli	after exposure to process solutions; IPC-TM-650.2.4.8
	1.31 kN/m	7.50 pli	after solder float; IPC-TM-650.2.4.8

Thermal Properties	Metric	English	Comments
CTE, linear	12.0 - 15.0 µm/m-°C @Temperature -40.0 - 125 °C	6.67 - 8.33 µin/in-°F @Temperature -40.0 - 257 °F	IPC-TM-650.2.4.41
Glass Transition Temp, Tg	250 °C	482 °F	TMA; IPC-TM-650.2.4.24c
	260 °C	500 °F	DSC; IPC-TM-650.2.4.25c
Decomposition Temperature	389 °C	732 °F	5% weight loss; TGA; IPC-TM-650.2.4.24.6
Flammability, UL94	V-0	V-0

Electrical Properties	Metric	English	Comments
Volume Resistivity	1.00e+13 ohm-cm	1.00e+13 ohm-cm	C - 96/35/90; IPC-TM-650.2.5.17.1
	1.00e+13 ohm-cm	1.00e+13 ohm-cm	E - 24/125; IPC-TM-650.2.5.17.1
Surface Resistance	1.00e+13 ohm	1.00e+13 ohm	C - 96/35/90; IPC-TM-650.2.5.17.1
	1.00e+13 ohm	1.00e+13 ohm	E - 24/125; IPC-TM-650.2.5.17.1
Dielectric Constant	3.8 @Frequency 1.00e+10 Hz	3.8 @Frequency 1.00e+10 Hz	Stripline; IPC-TM-650.2.5.5.5
	3.9 @Frequency 1.00e+10 Hz	3.9 @Frequency 1.00e+10 Hz	Split Post Cavity
	3.9 @Frequency 1.00e+9 Hz	3.9 @Frequency 1.00e+9 Hz	RF Impedance; IPC-TM-650.2.5.5.9
	3.9 @Frequency 2.50e+9 Hz	3.9 @Frequency 2.50e+9 Hz	Stripline; IPC-TM-650.2.5.5.5
Dielectric Strength	53.1 kV/mm	1350 kV/in	IPC-TM-650.2.5.6.2
Dielectric Breakdown	>= 50000 V	>= 50000 V	IPC-TM-650.2.5.6
Dissipation Factor	0.0095 @Frequency 1.00e+10 Hz	0.0095 @Frequency 1.00e+10 Hz	Split Post Cavity
	0.015 @Frequency 2.50e+9 Hz	0.015 @Frequency 2.50e+9 Hz	Stripline; IPC-TM-650.2.5.5.5
	0.016 @Frequency 1.00e+10 Hz	0.016 @Frequency 1.00e+10 Hz	Stripline; IPC-TM-650.2.5.5.5
Arc Resistance	136 sec	136 sec	IPC-TM-650.2.5.1

Descriptive Properties	Value	Comments
Methylene Chloride Resistance (% Weight Change)	0.42	IPC-TM-650.2.3.4.3
Pressure Cooker	Pass	60 min then solder dip @288ºC until failure (max 10 min.); IPC-TM-650.2.6.16 (modified)
T260 (minutes)	12+	IPC-TM-650.2.4.24.1
Z Axis Expansion (%)	1.8	50ºC to 260ºC; IPC-TM-650.2.4.41

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