Park Electrochemical Nelco® N5000-30/32 BT Epoxy Package

Category	Polymer , Thermoset , Epoxy
Manufacturer	Park Electrochemical Corp.
Trade Name	Nelco®
Port	Shanghai port,China
Trade Terms	FOB, CFR, CIF
Payment Terms	L/C, T/T, Western Union
Download PDF	Park Electrochemical Nelco® N5000-30/32 BT Epoxy Package.pdf
Price	EMAIL US sales@lookpolymers.com
	Online Service lookpolymers 27660005

Material Notes:

The Nelco N5000-30 prepreg and N5000-32 laminate BT epoxy materials are designed specifically to meet or exceed new and emerging chippackaging requirements. The primary applications of these materials include high performance interconnects that form the circuitry inside plastic BGAs, PBGAs and LGAs.Key Features and Benefits:BT resin chemistryExcellent Reliability and PerformanceChip Packaging OptionsMeets JEDEC StandardsWide processing latitudeApplications/Qualifications:BGA MultilayersPBGALGPCMCIAMCM-LsDirect Chip AttachJEDEC Conforming PackagesRoHS CompliantMeets IPC-4101/30 SpecificationsInformation provided by Park Electrochemical Corp.

Physical Properties	Metric	English	Comments
Water Absorption	<= 0.050 %	<= 0.050 %	IPC-TM-650.2.6.2.1

Mechanical Properties	Metric	English	Comments
Modulus of Elasticity	22.8 GPa	3300 ksi	Y; ASTM D3039
	23.4 GPa	3400 ksi	X; ASTM D3039
Poissons Ratio	0.21	0.21	X; ASTM D3039
	0.21	0.21	Y; ASTM D3039
Shear Modulus	9.42 - 9.67 GPa	1370 - 1400 ksi	Calculated
Peel Strength	1.53 kN/m	8.70 pli	at elevated temperature; IPC-TM-650.2.4.8.2a
	1.61 kN/m	9.20 pli	after solder float; IPC-TM-650.2.4.8

Thermal Properties	Metric	English	Comments
CTE, linear	14.0 µm/m-°C @Temperature -40.0 - 125 °C	7.78 µin/in-°F @Temperature -40.0 - 257 °F	IPC-TM-650.2.4.41
Glass Transition Temp, Tg	205 °C	401 °F	DMA (Tan d Peak); IPC-TM-650.2.4.24.3
Decomposition Temperature	344 °C	651 °F	5% weight loss; TGA; IPC-TM-650.2.4.24.6
Flammability, UL94	V-0	V-0

Electrical Properties	Metric	English	Comments
Volume Resistivity	1.00e+15 ohm-cm	1.00e+15 ohm-cm	C - 96/35/90; IPC-TM-650.2.5.17.1
Surface Resistance	1.00e+14 ohm	1.00e+14 ohm	C - 96/35/90; IPC-TM-650.2.5.17.1
Dielectric Constant	4.1 @Frequency 1.00e+9 Hz	4.1 @Frequency 1.00e+9 Hz	RF Impedance; IPC-TM-650.2.5.5.9
	4.4 @Frequency 1.00e+6 Hz	4.4 @Frequency 1.00e+6 Hz	TFC/LCR Meter; IPC-TM-650.2.5.5.3
Dielectric Strength	68.9 kV/mm	1750 kV/in	IPC-TM-650.2.5.6.2
Dielectric Breakdown	>= 50000 V	>= 50000 V	IPC-TM-650.2.5.6
Dissipation Factor	0.0090 @Frequency 1.00e+6 Hz	0.0090 @Frequency 1.00e+6 Hz	TFC/LCR Meter; IPC-TM-650.2.5.5.3
Arc Resistance	145 sec	145 sec	IPC-TM-650.2.5.1

Descriptive Properties	Value	Comments
Pressure Cooker	Pass	60 min then solder dip @288ºC until failure (max 10 min.); IPC-TM-650.2.6.16 (modified)
T260 (minutes)	12+	IPC-TM-650.2.4.24.1
Z Axis Expansion (%)	3.6	50ºC to 260ºC; IPC-TM-650.2.4.41

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