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Nihon Superior SN100C Lead-Free Solder Alloy

Category Metal , Nonferrous Metal , Solder/Braze Alloy , Tin Alloy
Manufacturer Nihon Superior
Trade Name
Port Ningbo port,China
Trade Terms FOB, CFR, CIF
Payment Terms L/C, T/T, Western Union
Download PDF Nihon Superior SN100C Lead-Free Solder Alloy.pdf
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Material Notes:
Allows high productivity in soldering processes and cost effective, reliable joints. Attributes include high fluidity, low copper erosion, low drossing, superior wetting and freedom from shrinkage defects. Introduced 1999 for the soldering of VCR boards. Nickel content imparts the wetting and flow properties that make it possible to achieve excellent results in wave soldering at process temperatures comparable with those used with the tin-lead solder it replaces. Performance in wave soldering at least matches that of more expensive silver-containing alloys and the resulting joints are smoother and brighter.
Physical Properties Metric English Comments
Specific Gravity 7.40 g/cc
7.40 g/cc
Mechanical Properties Metric English Comments
Hardness, Vickers 12.9
12.9
Fast Cooling
16.1
16.1
Slow Cooling
Tensile Strength 32.0 MPa
4640 psi
Elongation at Break 48 %
48 %
Thermal Properties Metric English Comments
CTE, linear 23.9 µm/m-°C

@Temperature 30.0 - 80.0 °C
13.3 µin/in-°F

@Temperature 86.0 - 176 °F
ramp rate 10°/min.
24.8 µm/m-°C

@Temperature 80.0 - 130 °C
13.8 µin/in-°F

@Temperature 176 - 266 °F
ramp rate 10°/min.
26.3 µm/m-°C

@Temperature 130 - 180 °C
14.6 µin/in-°F

@Temperature 266 - 356 °F
ramp rate 10°/min.
Specific Heat Capacity 0.220 J/g-°C
0.0526 BTU/lb-°F
Thermal Conductivity 64.0 W/m-K
444 BTU-in/hr-ft²-°F
Melting Point 227 °C
441 °F
Component Elements Properties Metric English Comments
Aluminum, Al <= 0.0020 %
<= 0.0020 %
Impurity Limit
Antimony, Sb <= 0.050 %
<= 0.050 %
Impurity Limit
Arsenic, As <= 0.030 %
<= 0.030 %
Impurity Limit
Bismuth, Bi <= 0.030 %
<= 0.030 %
Impurity Limit
Cadmium, Cd <= 0.0020 %
<= 0.0020 %
Impurity Limit
Copper, Cu 0.70 %
0.70 %
Germanium, Ge <= 0.010 %
<= 0.010 %
Iron, Fe <= 0.020 %
<= 0.020 %
Impurity Limit
Lead, Pb <= 0.050 %
<= 0.050 %
Impurity Limit
Nickel, Ni 0.050 %
0.050 %
Tin, Sn 99.25 %
99.25 %
As Remainder
Zinc, Zn <= 0.0020 %
<= 0.0020 %
Impurity Limit
Electrical Properties Metric English Comments
Electrical Resistivity 0.0000130 ohm-cm
0.0000130 ohm-cm
Processing Properties Metric English Comments
Processing Temperature 240 - 245 °C
464 - 473 °F
Reflow Soldering (Peak)
250 - 260 °C
482 - 500 °F
Wave Soldering
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