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Momentive Performance Materials RTV511 Silicone Rubber Compound for Low Temperature Potting, Encapsulating and Sealing, White

Category Polymer , Adhesive , Thermoset , Silicone , Silicone, RTV, Adhesive/Sealant Grade
Manufacturer Momentive Performance Materials (Former GE Silicones)
Trade Name
Port Shanghai port,China
Trade Terms FOB, CFR, CIF
Payment Terms L/C, T/T, Western Union
Download PDF Momentive Performance Materials RTV511 Silicone Rubber Compound for Low Temperature Potting, Encapsulating and Sealing, White.pdf
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Material Notes:
RTV511, RTV560 and RTV577 silicone rubber compounds are low temperature two-part silicone elastomers. They are supplied ready to use with a base compound and DEBT (deputy tin deflagrate) as the standard curing agent. DEBT is suitable for most applications, however, other catalysts are available to facilitate deep section cure, faster cure and automated mixing.Mechanical and electrical properties for 0.5 wt% DEBT curing agent added, cured 7 days at 25°C and 50% relative humidity.Key Performance Properties: Variable work times and cure rates by adjusting the amount and type of curing agentRoom temperature cure Composition free of solvents and solvent odorExcellent adhesion capabilities with primerExcellent release propertiesApplications: Cast-in-place heat shieldingThermal insulationLow and high-temperature bondingPotting and encapsulation of electrical assembliesGE Silicones became a part of Momentive Performance Materials in 2006.
Physical Properties Metric English Comments
Specific Gravity 1.21 g/cc
1.21 g/cc
Viscosity 16000 cP
16000 cP
Linear Mold Shrinkage 0.013 cm/cm
0.013 in/in
Mechanical Properties Metric English Comments
Hardness, Shore A 42
42
Tensile Strength, Ultimate 2.65 MPa
384 psi
Elongation at Break 170 %
170 %
Tear Strength 3.73 kN/m
21.3 pli
Thermal Properties Metric English Comments
CTE, linear 220 µm/m-°C

@Temperature 20.0 °C
122 µin/in-°F

@Temperature 68.0 °F
Specific Heat Capacity 1.46 J/g-°C
0.350 BTU/lb-°F
Thermal Conductivity 0.260 W/m-K
1.80 BTU-in/hr-ft²-°F
Maximum Service Temperature, Air 204 °C
399 °F
Continuous
260 °C
500 °F
Intermittent
Brittleness Temperature -115 °C
-175 °F
Electrical Properties Metric English Comments
Volume Resistivity 2.00e+14 ohm-cm
2.00e+14 ohm-cm
Dielectric Constant 3.6

@Frequency 1000 Hz
3.6

@Frequency 1000 Hz
Dielectric Strength 20.5 kV/mm
521 kV/in
Dissipation Factor 0.0050

@Frequency 1000 Hz
0.0050

@Frequency 1000 Hz
Processing Properties Metric English Comments
Cure Time 1440 min

@Temperature 25.0 °C
24.0 hour

@Temperature 77.0 °F
0.5% DBT curing agent added
Descriptive Properties Value Comments
Color White
Consistency Pourable
Work Time 1.5 hours
At 25°C, 0.5% DBT curing agent added
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