Master Bond Supreme 3HTND-2GT One Part, Toughened, Fast Curing Glob Top Adhesive

Master Bond Polymer System Supreme 3HTND-2GT is a fast curing, toughened one component high performance epoxy adhesive/sealant which meets the growing need for precise positioning and bonding of microelectronic components and other devices on printed circuit boards and other electronic assemblies. It offers remarkably high durable protection against adverse environmental conditions, vibration, impact and thermal shock for components on circuit boards including the more fragile and delicate ones. Additionally, Supreme 3HTND-2GT has excellent electrical insulation properties, high physical strength characteristics and superior adhesion to metals, plastics and ceramics, as well as to flexible and rigid circuit board materials. Supreme 3HTND-2GT can be easily applied to specific, sharply defined circuit board areas and will not flow during application or cure beyond the desired board section.