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Master Bond MasterSil 151Med Medical Grade Silicone Potting Compound

Category Polymer , Thermoset , Silicone
Manufacturer Master Bond Inc.
Trade Name Mastersil
Port Shanghai port,China
Trade Terms FOB, CFR, CIF
Payment Terms L/C, T/T, Western Union
Download PDF Master Bond MasterSil 151Med Medical Grade Silicone Potting Compound.pdf
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Material Notes:
Description: Master Bond MasterSil 151Med is a two component, low viscosity silicone compound for high performance potting and encapsulation. MasterSil 151Med is an addition cured system and does not require exposure to air for complete cross-linking. It has a convenient ten to one mix ratio by weight, and will not outgas while curing. It is 100% solids and contains no solvents. MasterSil 151Med has an exceptionally low viscosity enabling it to be highly desirable for potting and encapsulation. First and foremost, MasterSil 151Med, as is true with silicones in general, offers flexibility and high temperature resistance. It has good electrical insulation properties. The system’s flexibility allows it to withstand severe thermal cycling and resist vibration and shock. MasterSil 151Med resists gamma radiation, ETO and various chemical sterilants. These properties enable this system to be well suited for medical applications involving optical and electrical components. It can also be used for encapsulating electronic circuitry, LEDs, optical fibers and other optical components in a wide array of medical devices. MasterSil 151Med is transparent and has a service temperature range of -65°F to +400°F. It fully passes USP Class VI testing for biocompatibility. Product Advantages: Addition cured; no by-products released during cure; does not require air for curing Low exotherm; very long pot life; low viscosity ideal for potting and encapsulation Readily cures at ambient temperatures or faster cure at elevated temperatures Can cure in thicknesses beyond 1 inch Very low shrinkage upon cure Excellent optical clarity and transmission properties Meets USP Class VI specification Good electrical insulation properties; highly resistant to waterKey Features Meets USP Class VI specifications High flexibility Optically clear Serviceable from -65°F to +400°F Electrically insulative Low viscosityInformation provided by MasterBond®
Physical Properties Metric English Comments
Viscosity 50 - 150 cP
50 - 150 cP
Part B
2000 - 4000 cP
2000 - 4000 cP
Part A
Mechanical Properties Metric English Comments
Hardness, Shore A 40 - 50
40 - 50
Tensile Strength at Break 5.52 - 6.21 MPa
800 - 900 psi
Elongation at Break 120 - 150 %
120 - 150 %
Shear Strength >= 0.345 MPa
>= 50.0 psi
Bond, Al to Al
Thermal Properties Metric English Comments
CTE, linear 220 - 240 µm/m-°C
122 - 133 µin/in-°F
Maximum Service Temperature, Air 204 °C
400 °F
Minimum Service Temperature, Air -53.9 °C
-65.0 °F
Optical Properties Metric English Comments
Refractive Index 1.43
1.43
Transmission, Visible 90 %
90 %
transparent; thickness not quantified
Electrical Properties Metric English Comments
Volume Resistivity 1.00e+14 ohm-cm
1.00e+14 ohm-cm
Dielectric Constant 2.7

@Frequency 100 Hz,
Temperature 25.0 °C
2.7

@Frequency 100 Hz,
Temperature 77.0 °F
Dielectric Strength 17.7 kV/mm

@Thickness 3.17 mm
450 kV/in

@Thickness 0.125 in
Processing Properties Metric English Comments
Cure Time 60.0 - 120 min

@Temperature 93.3 °C
1.00 - 2.00 hour

@Temperature 200 °F
1440 - 2880 min

@Temperature 23.9 °C
24.0 - 48.0 hour

@Temperature 75.0 °F
Pot Life 2.0 - 4.0 min
2.0 - 4.0 min
100 gram batch
Shelf Life 6.00 Month

@Temperature 23.9 °C
6.00 Month

@Temperature 75.0 °F
in original unopened containers
Descriptive Properties Value Comments
Mixing Ratio (A to B) 100:1
by weight
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