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Master Bond EP51M Fast Curing Thermal Cycling Resistant Epoxy Adhesive

Category Polymer , Adhesive , Thermoset , Epoxy , Epoxy Adhesive
Manufacturer Master Bond Inc.
Trade Name
Port Shanghai port,China
Trade Terms FOB, CFR, CIF
Payment Terms L/C, T/T, Western Union
Download PDF Master Bond EP51M Fast Curing Thermal Cycling Resistant Epoxy Adhesive.pdf
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  Online Service   lookpolymers   27660005
Material Notes:
Master Bond Polymer Adhesive EP51M is a fast "3 minute" curing two component epoxy adhesive for general purpose bonding formulated to cure at room temperature with a one-to-one mix ratio by weight or volume. It readily develops a high bonding strength of more than 2000 psi at room temperature. The bonding strength is relatively insensitive to cleaning procedures. EP51M features superior durability, thermal shock and chemical resistance.
Physical Properties Metric English Comments
Viscosity 8000 - 9000 cP

@Temperature 23.0 °C
8000 - 9000 cP

@Temperature 73.4 °F
Thermal Properties Metric English Comments
Maximum Service Temperature, Air 121 °C
250 °F
Minimum Service Temperature, Air -269 °C
-453 °F
Processing Properties Metric English Comments
Cure Time 180 - 210 min

@Temperature 23.0 °C
3.00 - 3.50 hour

@Temperature 73.4 °F
Descriptive Properties Value Comments
Color Code "A" Amber; "B" Tan
Mix Ratio By Weight 100/100
Set-Up Time, minutes 3
At Room Temperature
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