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Master Bond EP34 Room Temperature Curing Two Component Epoxy System

Category Polymer , Adhesive , Thermoset , Epoxy , Epoxy Adhesive
Manufacturer Master Bond Inc.
Trade Name
Port Shanghai port,China
Trade Terms FOB, CFR, CIF
Payment Terms L/C, T/T, Western Union
Download PDF Master Bond EP34 Room Temperature Curing Two Component Epoxy System.pdf
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Material Notes:
Master Bond Polymer System EP34 is a unique room temperature curing two component epoxy compound for high temperature potting and encapsulating applications. Adhesion to metals, glass, ceramics, wood, vulcanized rubbers and many plastics is excellent. The hardened epoxy is a superior electrical insulator.
Physical Properties Metric English Comments
Viscosity 70000 - 80000 cP

@Temperature 23.0 °C
70000 - 80000 cP

@Temperature 73.4 °F
Thermal Properties Metric English Comments
Maximum Service Temperature, Air 232 °C
450 °F
Minimum Service Temperature, Air -51.1 °C
-60.0 °F
Processing Properties Metric English Comments
Cure Time 60.0 - 120 min

@Temperature 93.3 °C
1.00 - 2.00 hour

@Temperature 200 °F
1440 - 2880 min

@Temperature 23.0 °C
24.0 - 48.0 hour

@Temperature 73.4 °F
Descriptive Properties Value Comments
Color Code "A" Black; "B" Amber
Mix Ratio By Weight 100/70
Set-Up Time, minutes 50-60
At Room Temperature
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