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Master Bond EP30LTE Low Thermal Expansion, Dimensionally Stable Epoxy

Category Polymer , Adhesive , Thermoset , Epoxy , Epoxy Adhesive
Manufacturer Master Bond Inc.
Trade Name
Port Shanghai port,China
Trade Terms FOB, CFR, CIF
Payment Terms L/C, T/T, Western Union
Download PDF Master Bond EP30LTE Low Thermal Expansion, Dimensionally Stable Epoxy.pdf
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Material Notes:
Master Bond Polymer System EP30LTE is a recently developed epoxy resin system with good low thermal expansion properties and dimensional stability for high performance bonding, coating, sealing and casting. The cured material is an excellent electrical insulator and has superior chemical resistance to many chemicals.
Physical Properties Metric English Comments
Viscosity 15000 - 20000 cP

@Temperature 23.0 °C
15000 - 20000 cP

@Temperature 73.4 °F
Thermal Properties Metric English Comments
Maximum Service Temperature, Air 121 °C
250 °F
Minimum Service Temperature, Air -51.1 °C
-60.0 °F
Processing Properties Metric English Comments
Cure Time 120 - 180 min

@Temperature 93.3 °C
2.00 - 3.00 hour

@Temperature 200 °F
1440 - 2880 min

@Temperature 23.0 °C
24.0 - 48.0 hour

@Temperature 73.4 °F
Descriptive Properties Value Comments
Color Code "A" Black; "B" Clear
Mix Ratio By Weight 100/10
Set-Up Time, minutes 30-40
At Room Temperature
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