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Lord Adhesives Circalokâ„¢ EP-939 Epoxy Board Level Encapsulant

Category Polymer , Thermoset , Epoxy , Epoxy Encapsulant, Unreinforced
Manufacturer Lord Adhesives
Trade Name Circalok™
Port Shanghai port,China
Trade Terms FOB, CFR, CIF
Payment Terms L/C, T/T, Western Union
Download PDF Lord Adhesives Circalokâ„¢ EP-939 Epoxy Board Level Encapsulant.pdf
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Material Notes:
LORD Thermosetâ„¢ EP-939 encapsulant is a black, one-component epoxy specifically designed to meet the needs of coating semiconductor devices on printed circuit boards.All information provided by Lord.
Physical Properties Metric English Comments
Specific Gravity 1.49 g/cc
1.49 g/cc
Brookfield Viscosity 30000 - 44400 cP

@Temperature 25.0 °C
30000 - 44400 cP

@Temperature 77.0 °F
Spindle 6 @ 10rpm
Mechanical Properties Metric English Comments
Hardness, Shore D 87 - 95
87 - 95
Modulus of Elasticity 1.00 GPa
145 ksi
DMA
Thermal Properties Metric English Comments
CTE, linear 45.0 µm/m-°C
25.0 µin/in-°F
Below Tg; TMA
Glass Transition Temp, Tg 125 °C
257 °F
TMA
Electrical Properties Metric English Comments
Volume Resistivity 1.00e+15 ohm-cm

@Temperature 25.0 °C
1.00e+15 ohm-cm

@Temperature 77.0 °F
Dielectric Constant 4.0

@Frequency 1.00e+6 Hz
4.0

@Frequency 1.00e+6 Hz
Dissipation Factor 0.010

@Frequency 1.00e+6 Hz
0.010

@Frequency 1.00e+6 Hz
Processing Properties Metric English Comments
Cure Time 20.0 min

@Temperature 150 °C
0.333 hour

@Temperature 302 °F
Pot Life 40320 min

@Temperature 25.0 °C
40320 min

@Temperature 77.0 °F
Gel Time 4.00 min

@Temperature 150 °C
4.00 min

@Temperature 302 °F
Shelf Life 6.00 Month

@Temperature 0.000 - 5.00 °C
6.00 Month

@Temperature 32.0 - 41.0 °F
Descriptive Properties Value Comments
Appearance Black
Consistency Paste
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