Loctite® CHIPBONDER® 3619 Low Temperature Cure, Syringe Dispense

Surface Mount AdhesivesLoctite® Chipbonder® Surface Mount Adhesives (SMAs) maintain component positioning during wave solder and solder reflow processes. Loctite offers a variety of application techniques including syringe dispense, stencil print and pin transfer.Loctite® syringe dispense products provide good performance for electronics assembly:High Speed DispenseLow Temperature CureProducts for difficult-to-bond substratesLoctite® 3619 CHIPBONDER® Low Temperature Cure, Syringe DispenseA low temperature curing adhesive designed for high-speed syringe dispense.Peaked dot profile. Process Method:High speedSyringe dispensing40,000 DPH capable Storage (Protect from heat): 40°F (+/-5°F) or 5°C (+/-3°C)