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Loctite® 3860 Thermally Conductive Potting

Category Polymer , Adhesive , Thermoset , Epoxy , Epoxy Encapsulant, Unreinforced
Manufacturer Loctite
Trade Name
Port Ningbo port,China
Trade Terms FOB, CFR, CIF
Payment Terms L/C, T/T, Western Union
Download PDF Loctite® 3860 Thermally Conductive Potting.pdf
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Material Notes:
Potters and Thermally Conductive BondersLoctite® Thermally Conductive Adhesives eliminate the need for mechanical fasteners and clips, while providing the most efficient thermal transfer between transistors or microprocessors and their heat sinks. Loctite offers a wide range of adhesive chemistries including silicones, acrylics and epoxies. Many processing options are available for curing these adhesives such as heat cure, activator cure, and UV light.Loctite® Potting materials are used on electronic device housings to enhance mechanical strength, provide electrical insulation and enhance vibration and shock resistance of assemblies. For electronics assembly, Loctite offers deep potting, high adhesion, non-corrosive, and thermally conductive potting products. These can be cured with heat, UV light, or moisture.Loctite® 3860 Thermally Conductive PottingA thermally conductive, room temperature curing, potting compound for general applications requiring thermal conductivity. Cure Type: Heat Bonding Type: 2-part epoxy (100:9.5)
Physical Properties Metric English Comments
Viscosity <= 20000 cP
<= 20000 cP
Mixed
Mechanical Properties Metric English Comments
Hardness, Shore D 89
89
Thermal Properties Metric English Comments
CTE, linear 32.0 µm/m-°C

@Temperature 20.0 °C
17.8 µin/in-°F

@Temperature 68.0 °F
Glass Transition Temp, Tg 60.0 °C
140 °F
Processing Properties Metric English Comments
Cure Time 120 min
2.00 hour
65ºC
2880 min
48.0 hour
25ºC
Pot Life 120 min

@Temperature 23.0 °C
120 min

@Temperature 73.4 °F
Gel Time 720 min
720 min
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