Loctite® 3607 Pin Transfer

Surface Mount AdhesivesLoctite® Chipbonder® Surface Mount Adhesives (SMAs) maintain component positioning during wave solder and solder reflow processes. Loctite offers a variety of application techniques including syringe dispense, stencil print and pin transfer.Loctite® syringe dispense products provide good performance for electronics assembly:High Speed DispenseLow Temperature CureProducts for difficult-to-bond substratesLoctite® 3607 Pin TransferA surface mount adhesive for pin transfer applications. Very low moisture pickup designed for use with open reservoir applications.Rounded dot profile. Process Method:Pin Transfer Storage (Protect from heat): 40°F (+/-5°F) or 5°C (+/-3°C)