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Loctite® 3565 High performance epoxy, high Tg and low CTE High Tg Underfill

Category Polymer , Adhesive , Thermoset
Manufacturer Loctite
Trade Name
Port Ningbo port,China
Trade Terms FOB, CFR, CIF
Payment Terms L/C, T/T, Western Union
Download PDF Loctite® 3565 High performance epoxy, high Tg and low CTE High Tg Underfill.pdf
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Material Notes:
COB/DCA Encapsulants are essential to the reliability of flip chip assemblies because they minimize the thermal mismatch between the flip chip and substrate.Loctite® Underfills and Encapsulants improve assembly operations by providing superior reliability and faster throughput. Improved reliability is achieved through products that have a high Tg, low CTE, high throughput and excellent adhesion. Faster throughput and higher yields are achieved through faster flow characteristics and increased cure speeds.Loctite® 3565 High performance epoxy, high Tg and low CTE High Tg UnderfillA high performance underfill for flip chip devices. Specifically formatted for high reliability, hybrid and MCM applications. Designed for gaps down to 1 mil.
Physical Properties Metric English Comments
Density 1.74 g/cc
0.0629 lb/in³
Viscosity 45000 cP
45000 cP
Haake cone and plate rheometer @ 5/sec (35mm/2° cone)
Mechanical Properties Metric English Comments
Tensile Modulus 3.45 GPa
500 ksi
Thermal Properties Metric English Comments
CTE, linear 25.0 µm/m-°C

@Temperature 20.0 °C
13.9 µin/in-°F

@Temperature 68.0 °F
Glass Transition Temp, Tg 155 °C
311 °F
Processing Properties Metric English Comments
Cure Time 30.0 min

@Temperature 150 °C
0.500 hour

@Temperature 302 °F
Full Cure
Shelf Life 3.00 Month

@Temperature -40.0 °C
3.00 Month

@Temperature -40.0 °F
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