Songhan Plastic Technology Co.,Ltd.
 POLYMER SEARCH

Loctite® 3564 Fast flow epoxy, moderate CTE and Tg Fast Flow Underfill

Category Polymer , Adhesive , Thermoset , Epoxy , Epoxy Encapsulant, Unreinforced
Manufacturer Loctite
Trade Name
Port Shanghai port,China
Trade Terms FOB, CFR, CIF
Payment Terms L/C, T/T, Western Union
Download PDF Loctite® 3564 Fast flow epoxy, moderate CTE and Tg Fast Flow Underfill.pdf
Price EMAIL US    sales@lookpolymers.com
  Online Service   lookpolymers   27660005
Material Notes:
COB/DCA Encapsulants are essential to the reliability of flip chip assemblies because they minimize the thermal mismatch between the flip chip and substrate.Loctite® Underfills and Encapsulants improve assembly operations by providing superior reliability and faster throughput. Improved reliability is achieved through products that have a high Tg, low CTE, high throughput and excellent adhesion. Faster throughput and higher yields are achieved through faster flow characteristics and increased cure speeds.Loctite® 3564 Fast flow epoxy, moderate CTE and Tg Fast Flow UnderfillAn extremely fast flowing, rapid cure underfill for industrial and consumer flip chip applications. Withstands operating temperatures up to 125°C.
Physical Properties Metric English Comments
Density 1.50 g/cc
0.0542 lb/in³
Viscosity 3000 cP
3000 cP
Haake cone and plate rheometer @ 5/sec (35mm/2° cone)
Mechanical Properties Metric English Comments
Tensile Modulus 3.10 GPa
450 ksi
Thermal Properties Metric English Comments
CTE, linear 35.0 µm/m-°C

@Temperature 20.0 °C
19.4 µin/in-°F

@Temperature 68.0 °F
Glass Transition Temp, Tg 125 °C
257 °F
Processing Properties Metric English Comments
Cure Time 20.0 min

@Temperature 150 °C
0.333 hour

@Temperature 302 °F
Shelf Life 3.00 Month

@Temperature -40.0 °C
3.00 Month

@Temperature -40.0 °F
Copyright © lookpolymers.com All Rights Reserved