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Loctite® 3445 1 component fusible solder filler Anisotropic Epoxy Adhesive

Category Polymer , Adhesive , Thermoset , Epoxy , Epoxy, Electrically Conductive
Manufacturer Loctite
Trade Name
Port Ningbo port,China
Trade Terms FOB, CFR, CIF
Payment Terms L/C, T/T, Western Union
Download PDF Loctite® 3445 1 component fusible solder filler Anisotropic Epoxy Adhesive.pdf
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Material Notes:
Electrically Conductive Bonding and Encapsulants and UnderfillsLoctite® Electrically Conductive Adhesives are used in a variety of applications where electrical connectivity is needed, providing a conductive path where traditional methods such as solder, are not practical. Electrically Conductive Adhesives are ideal for attaching temperature sensitive components, or providing electrical interconnections on non-solderable substrates, such as plastic and glass.Loctite offers a complete line of electrically conductive adhesives to meet almost any need including: flexible, heat cure, room temperature cure, screen printable, high adhesion, and rapid cure.COB/DCA Encapsulants are essential to the reliability of flip chip assemblies because they minimize the thermal mismatch between the flip chip and substrate.Loctite® Underfills and Encapsulants improve assembly operations by providing superior reliability and faster throughput. Improved reliability is achieved through products that have a high Tg, low CTE, high throughput and excellent adhesion. Faster throughput and higher yields are achieved through faster flow characteristics and increased cure speeds.Loctite® 3445 1 component fusible solder filler Anisotropic Epoxy AdhesiveA fusible solder-filled epoxy for higher current applications such as power circuit applications, flex circuit interconnect, TAB interconnect, smart cards, and COB. Cure Type: Heat Bonding Type: Epoxy
Physical Properties Metric English Comments
Density 1.70 g/cc
0.0614 lb/in³
Thermal Properties Metric English Comments
CTE, linear <= 50.0 µm/m-°C

@Temperature 20.0 °C
<= 27.8 µin/in-°F

@Temperature 68.0 °F
Glass Transition Temp, Tg 120 °C
248 °F
Processing Properties Metric English Comments
Cure Time 1.00 min
0.0167 hour
60 sec. @ 180ºC under 100 psi load
Shelf Life 6.00 Month
6.00 Month
shelf life at 5ºC
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