Indium Corp. NanoFoilÂ® NF40 Nickel and Aluminum Localized Heat Source For Bonding

Category	Metal , Nonferrous Metal
Manufacturer	Indium Corporation of America
Trade Name	NanoFoil®
Port	Shanghai port,China
Trade Terms	FOB, CFR, CIF
Payment Terms	L/C, T/T, Western Union
Download PDF	Indium Corp. NanoFoilÂ® NF40 Nickel and Aluminum Localized Heat Source For Bonding.pdf
Price	EMAIL US sales@lookpolymers.com
	Online Service lookpolymers 27660005

Material Notes:

Features:40 microns thick - optimized for bonding electronics assembliesMinimum dimension 1.2mm x 2.0mmLocalized heat source for bondingEnables high-strength, high conductivity bonds between most combinations of materialsFlux-free processPick & place readyPb-freeComposition before Reaction - Alternating layers of Ni and AlComposition after Reaction - Ni50Al50Applications:Component mountingHigh brightness LEDConcentrated PhotoVoltaic (CPV)Power amplifiersthermal managementOptical component attachInformation provided by the manufacturer, Indium Corporation of America.

Physical Properties	Metric	English	Comments
Density	5.70 - 6.10 g/cc	0.206 - 0.220 lb/inÂ³
Thickness	40.0 - 80.0 microns	1.57 - 3.15 mil

Thermal Properties	Metric	English	Comments
Thermal Conductivity	35.0 - 50.0 W/m-K	243 - 347 BTU-in/hr-ftÂ²-Â°F

Descriptive Properties	Value	Comments
Autoignition Temperature	200Â°C	heat rate of 200Â°C/min
Heat of Reaction	1050 - 1250 J/g
Maximum Reaction Temperature	1350Â° - 1500Â°C
Reaction Velocity	6 - 10 m/s

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