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Hexion UP 802 Unsaturated Polyester Resin, High Surface Quality, Low Shrinkage, High Arc Resistance

Category Polymer , Thermoset , Filled/Reinforced Thermoset , Polyester, TS , Thermoset Polyester Glass Filled BMC
Manufacturer Hexion
Trade Name
Port Shanghai port,China
Trade Terms FOB, CFR, CIF
Payment Terms L/C, T/T, Western Union
Download PDF Hexion UP 802 Unsaturated Polyester Resin, High Surface Quality, Low Shrinkage, High Arc Resistance.pdf
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Material Notes:
Polyester molding compound, inorganically filled, glass fiber reinforced, styrene free, high dimensional stability, very slight post shrinkage, good mechanical properties, increased electrical values, standardized molding compound.Application areas: Ignition distributor caps, distributor fingers, spark plug connectors.This product was origianlly produced by Bak AG, now a part of Hexion.
Physical Properties Metric English Comments
Density 2.00 g/cc
0.0723 lb/in³
ISO 1183
Apparent Bulk Density 0.880 g/cc
0.0318 lb/in³
ISO 60
Linear Mold Shrinkage, Flow 0.0010 cm/cm
0.0010 in/in
Compression molding; ISO 2577
Mechanical Properties Metric English Comments
Ball Indentation Hardness 375 MPa
54400 psi
H 961/30; ISO 2039/P1
Flexural Strength 100 MPa
14500 psi
2 mm/min; ISO 178
Flexural Modulus 13.5 GPa
1960 ksi
ISO 178
Compressive Strength 200 MPa
29000 psi
Test specimen flat tested; ISO 604
Charpy Impact Unnotched 0.700 J/cm²

@Temperature 23.0 °C
3.33 ft-lb/in²

@Temperature 73.4 °F
ISO 179-1/2 eU
Charpy Impact, Notched 0.350 J/cm²

@Temperature 23.0 °C
1.67 ft-lb/in²

@Temperature 73.4 °F
ISO 179-1/2 eA
Thermal Properties Metric English Comments
Maximum Service Temperature, Air 170 °C
338 °F
<20000 hours; IEC 60216-P1
210 °C
410 °F
< 50 hours; IEC 60216-P1
Deflection Temperature at 8.0 MPa 200 °C
392 °F
ISO 75-2
Shrinkage 0.0300 %

@Temperature 110 °C
0.0300 %

@Temperature 230 °F
Compression molding; ISO 2577
Electrical Properties Metric English Comments
Volume Resistivity 1.00e+13 ohm-cm
1.00e+13 ohm-cm
IEC 60093
Surface Resistance 1.00e+12 ohm
1.00e+12 ohm
IEC 60093
Dielectric Constant 5.0

@Frequency 100 Hz
5.0

@Frequency 100 Hz
IEC 60250
Dielectric Strength 23.0 kV/mm

@Thickness 1.00 mm
584 kV/in

@Thickness 0.0394 in
IEC 60243-P1
Dissipation Factor 0.020

@Frequency 100 Hz
0.020

@Frequency 100 Hz
IEC 60250
Comparative Tracking Index 600 V
600 V
Test liquid A; IEC 60112
Processing Properties Metric English Comments
Feed Temperature 60.0 - 70.0 °C
140 - 158 °F
Injection molding
Nozzle Temperature 70.0 - 100 °C
158 - 212 °F
Injection molding
Melt Temperature 70.0 - 100 °C
158 - 212 °F
Injection molding
Mold Temperature 160 - 180 °C
320 - 356 °F
Injection molding
160 - 180 °C
320 - 356 °F
Compression molding
Injection Pressure >= 10.0 MPa
>= 1450 psi
Compression and injection cavity mold pressure
Back Pressure 0.500 - 1.00 MPa
72.5 - 145 psi
Injection molding
Cure Time 0.167 - 0.333 min
0.00278 - 0.00556 hour
Per 1 mm of wall thickness, injection molding
0.333 - 0.667 min
0.00556 - 0.0111 hour
Per 1 mm of wall thickness, compression molding
Descriptive Properties Value Comments
Creep Rupture Strength Good
Holding Pressure Approximately 40-60% of injection pressure
Media Resistance Medium
Moisture Absorption 20 mg
ISO 62, 24 hours at 23°C
Reserves by Peak Temperature Very High
Thermal Expansion Very Slight
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