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Hexcel® Redux® 610W (0.09 psf) Flame retarded epoxy film adhesive

Category Polymer , Adhesive , Film , Thermoset , Epoxy , Epoxy Adhesive
Manufacturer Hexcel
Trade Name
Port Shanghai port,China
Trade Terms FOB, CFR, CIF
Payment Terms L/C, T/T, Western Union
Download PDF Hexcel® Redux® 610W (0.09 psf) Flame retarded epoxy film adhesive.pdf
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Material Notes:
Redux 610 is a modified, flame-retarded epoxy film adhesive curing at 250°F. It is suitable for bonding metal to metal and for sandwich structures where flame retardancy and low heat release are required. Redux 610 is a hot melt film which is free from solvents and consequently has a very low volatile content.Features: Cures in 1 hour at 250°F; Good lap-shear performance up to 212°F; Good peel performance in sandwich structures up to 175°F; Meets the heat release requirements of IMO test MSC 61 (67); Good tack, drape and handleability; Very low volatile content and low out gassing properties; Available unsupported or with a very lightweight glass carrier.Applications: Metal to metal bonding; Sandwich constructions; Flame retarded performance
Physical Properties Metric English Comments
Storage Temperature -17.8 °C
0.000 °F
Processing Properties Metric English Comments
Shelf Life 18.0 Month

@Temperature -17.8 °C
18.0 Month

@Temperature 0.000 °F
Descriptive Properties Value Comments
Areal Weight (psf) 0.09
Roll Width (in) 49
Standard Roll (ft2) 1075
Support Woven Glass
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