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Hexcel® Redux® 609U Adhesive film for bonding metallic and composite components

Category Polymer , Adhesive , Film , Thermoset , Epoxy , Epoxy Adhesive
Manufacturer Hexcel
Trade Name
Port Shanghai port,China
Trade Terms FOB, CFR, CIF
Payment Terms L/C, T/T, Western Union
Download PDF Hexcel® Redux® 609U Adhesive film for bonding metallic and composite components.pdf
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Material Notes:
Redux 609 is a 250°F curing modified epoxy film adhesive containing a cottom scrim for easy handling and glue-line thickness control. It is available at standard areal weights of 0.06 psf and 0.04 psf and is also available unsupported at 0.06 psf.Features: Flexible cure cycle; Good lap shear performance at temperatures ranging from -67°F to 180°F; Good peel properties from -67°F to 180°F; Good tack to assist in adhesive joint assembly; Less than 1% volatile content; Suitable for bonding a wide range of substrates.Applications: Aluminum to aluminum bonding; Sandwich bonding with a variety of skins and cores
Mechanical Properties Metric English Comments
Shear Strength 31.0 MPa

@Temperature 21.1 °C
4500 psi

@Temperature 70.0 °F
Lap Shear
Processing Properties Metric English Comments
Shelf Life 12.0 Month

@Temperature -17.8 °C
12.0 Month

@Temperature 0.000 °F
Descriptive Properties Value Comments
Areal Weight (psf) 0.06
Roll Width (in) 49
Standard Roll (ft2) 1075
Support None
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