Hexcel® Redux® 319A High Performance Modified Epoxy Film Adhesive (0.05 psf)

Redux 319 is a high performance modified epoxy film adhesive curing at 350°F. It is available in both supported and unsupported versions at areal weights between 0.03 and 0.08 psf. The supported versions contain a woven nylon carrier for glueline thickness control and improved handleability. Redux 319 is a hot melt film which is free from solvents and consequently it has a very low volatile content.Features: Cures in 60 min at 350°F; Good performance at temperatures ranging from -67°F to 300°F; Good short-term exposure performance at 350°F; Excellent peel properties; Good drape at ambient temperatures; Less than 1% volatile content.Applications: Aluminum to aluminum bonding; Fiber-reinforced composite to composite bonding; Aluminum honeycomb sandwich bonding; Aramid honeycomb sandwich bonding.