Hexcel® Redux® 208/5-NA Foaming adhesive film

The Redux 200 series is a range fo foaming adhesive films presented in sheet form. They expand during the cure cycle to fill gaps and adhere strongly to all parts of the structure with which they come into contact. Redux foaming adhesive films are compative with Redux film adhesives.Features: High strength at temperatures from -67°F to 428°F; Less than 1% volatiles emitted during cure; Suitable for aluminum and fiber-reinforced composite sandwich constructions; Expansion ratios from 1:1.9 to 1:4.0.Application: Higher foaming ratio. Suitable for applications not requiring vacuum.Associated Film Adhesives: Redux 308, 308A-NA