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Hexcel® HexPly® 954-3 Curing Cyanate Resin
| Category | Polymer , Thermoset , Epoxy |
| Manufacturer | Hexcel |
| Trade Name | HexPly® |
| Port | Ningbo port,China |
| Trade Terms | FOB, CFR, CIF |
| Payment Terms | L/C, T/T, Western Union |
| Download PDF | Hexcel® HexPly® 954-3 Curing Cyanate Resin.pdf  |
| Price | EMAIL US sales@lookpolymers.com |
Material Notes:
HexPly® 954-3 is a 350°F (177°C) curing cyanate resin with excellent resistance to moisture absorption, outgassing and microcracking. HexPly® 954-3 is formulated for autoclave or press molding using a standard cure of two hours at 350°F (177°C). Glass transition temperature can be maximized by post curing at 450°F (232°C). The recommended lay-up procedure is HSP-L3. The recommended cure procedure is HSP-C1 or HSP-C2.Typical applications for HexPly® 954-3 include primary and secondary space structures and other applications where dimensional stability is critical.Information provided by HexCel
| Physical Properties | Metric | English | Comments |
|---|---|---|---|
| Density | 1.19 g/cc | 0.0430 lb/in³ | |
| Water Absorption | 0.70 % | 0.70 % | 50% GH/EQ |
| Moisture Absorption at Equilibrium | 0.18 % | 0.18 % | 55% RH/EQ |
| Outgassing - Total Mass Loss | 0.20 % | 0.20 % | 954-3; ASTM E595 |
| 1.0 % | 1.0 % | ASTM LIMITS; ASTM E595 | |
| Collected Volatile Condensable Material | 0.010 % | 0.010 % | 954-3; ASTM E595 |
| 0.10 % | 0.10 % | ASTM LIMITS; ASTM E595 |
| Mechanical Properties | Metric | English | Comments |
|---|---|---|---|
| Tensile Strength, Yield | 57.0 MPa @Temperature 23.0 °C |
8270 psi @Temperature 73.4 °F |
|
| Elongation at Break | 2.4 % | 2.4 % | |
| Tensile Modulus | 2.80 GPa @Temperature 23.0 °C |
406 ksi @Temperature 73.4 °F |
|
| Flexural Yield Strength | 77.0 MPa @Temperature 163 °C |
11200 psi @Temperature 325 °F |
Wet (7 day immersion at 71°C) |
| 87.0 MPa @Temperature 163 °C |
12600 psi @Temperature 325 °F |
||
| 119 MPa @Temperature 23.0 °C |
17300 psi @Temperature 73.4 °F |
||
| Flexural Modulus | 2.10 GPa @Temperature 163 °C |
305 ksi @Temperature 325 °F |
Wet (7 day immersion at 71°C) |
| 2.30 GPa @Temperature 163 °C |
334 ksi @Temperature 325 °F |
||
| 3.00 GPa @Temperature 23.0 °C |
435 ksi @Temperature 73.4 °F |
| Thermal Properties | Metric | English | Comments |
|---|---|---|---|
| CTE, linear | 55.1 µm/m-°C | 30.6 µin/in-°F | |
| Glass Transition Temp, Tg | 206 °C | 403 °F | No post cure |
| 258 °C | 496 °F | With post cure |
| Electrical Properties | Metric | English | Comments |
|---|---|---|---|
| Dielectric Constant | 2.73 @Frequency 1.00e+10 Hz, Temperature 23.0 °C |
2.73 @Frequency 1.00e+10 Hz, Temperature 73.4 °F |
Unconditioned; ASTM D2520 |
| 2.73 @Frequency 1.00e+10 Hz, Temperature 163 °C |
2.73 @Frequency 1.00e+10 Hz, Temperature 325 °F |
Unconditioned; ASTM D2520 | |
| 2.85 @Frequency 1.00e+10 Hz, Temperature 23.0 °C |
2.85 @Frequency 1.00e+10 Hz, Temperature 73.4 °F |
Moisture conditioned (71°C and 95% RH for 140 days); ASTM D2520 | |
| 2.85 @Frequency 1.00e+10 Hz, Temperature 163 °C |
2.85 @Frequency 1.00e+10 Hz, Temperature 325 °F |
Moisture conditioned (71°C and 95% RH for 140 days); ASTM D2520 | |
| Dielectric Loss Index | 0.0060 @Frequency 1.00e+10 Hz, Temperature 23.0 °C |
0.0060 @Frequency 1.00e+10 Hz, Temperature 73.4 °F |
Unconditioned; ASTM D2520 |
| 0.0080 @Frequency 1.00e+10 Hz, Temperature 163 °C |
0.0080 @Frequency 1.00e+10 Hz, Temperature 325 °F |
Unconditioned; ASTM D2520 | |
| 0.010 @Frequency 1.00e+10 Hz, Temperature 23.0 °C |
0.010 @Frequency 1.00e+10 Hz, Temperature 73.4 °F |
Moisture conditioned (71°C and 95% RH for 140 days); ASTM D2520 | |
| 0.020 @Frequency 1.00e+10 Hz, Temperature 163 °C |
0.020 @Frequency 1.00e+10 Hz, Temperature 325 °F |
Moisture conditioned (71°C and 95% RH for 140 days); ASTM D2520 |
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